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EFM32LG290F256G-F-BGA112

Silicon Labs

EFM32LG290F256G-F-BGA112 by Silicon Labs

EFM32LG290F256G-F-BGA112 by Silicon Labs is a 32-bit microcontroller with 28-bit address bus, operating at max 48 MHz. It features 2 DAC and 8 ADC channels, suitable for industrial applications requiring low power consumption and high-speed connectivity via I2C, SPI, UART, USART, USB interfaces.

Median Price

$13.190

Lifecycle Status

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Mouser Electronics

USA . 106 parts In-Stock

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$8.470

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$7.170

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Digiode

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Corphita

USA . 821 parts In-Stock

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Overview

Unlock the power of advanced microcontroller technology with the EFM32LG290F256G-F-BGA112 by Silicon Labs. This cutting-edge device offers unparalleled performance and reliability, making it a top choice for a wide range of applications. With its high-quality design and impressive features, including multiple DAC and ADC channels, DMA capabilities, and low power mode, this microcontroller provides unmatched value and benefits to customers. Whether you're designing IoT devices, consumer electronics, or industrial automation systems, the EFM32LG290F256G-F-BGA112 delivers exceptional performance and efficiency. Trust Silicon Labs to provide you with the tools you need to bring your innovative ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, suitable for various applications.

Surface Mount: YES

Easy to install on PCBs, saving space and improving efficiency.

Maximum Supply Voltage: 3.8 V

Allows for flexible power supply options and compatibility with various systems.

On Chip Data RAM Width: 32

Sufficient RAM for data storage and processing, enhancing performance.

Address Bus Width: 28

Wide address bus enables efficient memory access and data retrieval.

Package Shape: SQUARE

Compact square shape for easier PCB layout and space utilization.

Bit Size: 32

High bit size allows for complex operations and calculations.

DAC Channels: YES

Integrated DAC channels for analog signal generation and processing.

No. of Terminals: 112

Sufficient terminals for connectivity and interfacing with external devices.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array design with low profile and fine pitch for high-density mounting.

Minimum Supply Voltage: 1.98 V

Wide range of supply voltage support for flexibility in different applications.

Maximum Operating Temperature: 85 °C

Wide operating temperature range suitable for industrial applications.

CPU Family: CORTEX-M3

Advanced Cortex-M3 architecture for efficient processing and performance.

No. of External Interrupts: 16

Multiple external interrupts for timely response and event handling.

Minimum Operating Temperature: -40 °C

Wide temperature range support for operation in harsh environments.

Terminal Finish: NICKEL GOLD

Nickel gold finish for reliable and high-quality terminal connections.

ADC Channels: YES

Integrated ADC channels for analog signal conversion and processing.

DMA Channels: YES

Direct Memory Access channels for efficient data transfer and processing.

Terminal Position: BOTTOM

Bottom terminal position for easy soldering and secure PCB mounting.

ROM Words: 262144

Large ROM size for program storage and execution.

Maximum Seated Height: 1.3 mm

Low profile design for space-saving and compact PCB layout.

Digital To Analog Convertors: 2-CH 12-BIT

Dual-channel 12-bit DAC for accurate analog signal generation.

RAM Words: 8192

Sufficient RAM storage for data processing and temporary storage.

Width: 10 mm

Compact width for space-efficient PCB design and layout.

External Data Bus Width: 16

Wide external data bus for efficient data transfer with external devices.

Peripherals: COMPARATOR, BOD, DMA(12), POR, PWM, RTC, TIMER(5), WDT

Various peripherals for versatile functionality and enhanced capabilities.

Maximum Clock Frequency: 48 MHz

High clock frequency for fast processing and real-time operations.

Maximum Time At Peak Reflow Temperature (s): 40

Sufficient time for reflow process, ensuring reliable solder connections.

Peak Reflow Temperature °C: 260

High peak reflow temperature for secure and durable soldering.

Length: 10 mm

Compact length for space-efficient PCB integration and layout.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range support for rugged applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture for efficient and streamlined processing.

No. of Timers: 5

Multiple timers for precise timing and event scheduling.

RAM Bytes: 32768

Large RAM size for data storage and processing requirements.

Technology: CMOS

CMOS technology for low power consumption and efficient operation.

Terminal Form: BALL

Ball terminal form for secure and reliable electrical connections.

Analog To Digital Convertors: 8-Ch 12-Bit

Multiple 12-bit ADC channels for accurate analog signal conversion.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage for consistent performance and operation.

No. of DMA Channels: 12

Multiple DMA channels for efficient data transfer and processing.

PWM Channels: YES

Integrated PWM channels for precise signal modulation and control.

Connectivity: I2C(2), SPI, UART(2), USART, USB

Various connectivity options for interacting with external devices and systems.

ROM Programmability: FLASH

Programmable ROM with flash memory technology for easy firmware updates.

Terminal Pitch: 0.8 mm

Fine terminal pitch for high-density mounting and secure connections.

Format: FIXED POINT

Fixed-point format for accurate numerical calculations and data processing.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating for moderate moisture sensitivity during storage and handling.

Speed: 48 rpm

High processing speed of 48 RPM for efficient operation and performance.

Low Power Mode: YES

Low power mode for energy-efficient operation and extended battery life.

On Chip Program ROM Width: 8

On-chip ROM width of 8 bits for program storage and execution.

No. of I/O Lines: 90

Multiple I/O lines for input/output communication and interfacing with external devices.

Technical Specifications

Microcontrollers EFM32LG290F256G-F-BGA112 attributes and parameters. Explore more Microcontrollers devices from Silicon Labs

Specs

ADC Channels:

YES

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B112

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

12

No. of External Interrupts:

16

No. of I/O Lines:

90

No. of Terminals:

112

No. of Timers:

5

On Chip Data RAM Width:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA112,11X11,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

8192

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.3 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

1.98 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), SPI, UART(2), USART, USB

Peripherals:

COMPARATOR, BOD, DMA(12), POR, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

2-CH 12-BIT

Trade Compliance

EFM32LG290F256G-F-BGA112 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Silicon Labs

Silicon Laboratories, Inc. (Silicon Labs) is a fabless global technology company that designs and manufactures semiconductors, other silicon devices and software, which it sells to electronics design engineers and manufacturers in Internet of Things (IoT) infrastructure worldwide. It is headquartered in Austin, Texas, United States. The company focuses on microcontrollers (MCUs) and wireless system on chips (SoCs) and modules. The company also produces software stacks including firmware libraries and protocol-based software, and a free software development platform called Simplicity Studio. Silicon Labs was founded in 1996 and released its first product, an updated DAA design that enabled manufacturers to reduce the size and cost of a modem, two years later. During its first three years, the company focused on RF and CMOS integration, and developed the world's first CMOS RF synthesizer for mobile phones which was released in 1999. Following the appointment of Tyson Tuttle as the CEO in 2012, Silicon Labs has increasingly focused on developing technologies for the IoT market, which in 2019 accounted for more than 50 percent of the company's revenue, but in 2020 had increased to about 58 percent. In 1998, Silicon Labs released its first product, an updated Direct Access Arrangement (DAA) design that enabled manufacturers to reduce the size and cost of a modem.

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