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EFM32GG11B310F2048GQ100-BR

Silicon Labs

EFM32GG11B310F2048GQ100-BR by Silicon Labs

EFM32GG11B310F2048GQ100-BR by Silicon Labs is a 32-bit microcontroller with 86 I/O lines, 50 MHz clock frequency, and ADC/DMA channels. Ideal for applications requiring high-speed processing and precise analog-to-digital conversion in compact designs.

Median Price

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Lifecycle Status

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3

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Vyrian

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Nova Conductors

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Digiode

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AZTECH Wire

Italy . 851 parts In-Stock

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Ampacity Inc.

Singapore . 1,289 parts In-Stock

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Corohmni

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Advanced Electronics

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Argo Parts USA

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Microchip USA

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Continental Prestige Electronics

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Overview

Unlock the potential of your next project with the EFM32GG11B310F2048GQ100-BR by Silicon Labs. As a leading manufacturer in the industry, Silicon Labs has crafted a high-quality microcontroller that offers unmatched value and benefits. With its advanced features and versatile applications, this product is perfect for a wide range of projects. Experience the advantages of Silicon Labs technology and take your designs to the next level with this powerful microcontroller.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy installation and compact design, making the product suitable for small and space-limited applications.

Maximum Supply Voltage: 3.8 V

With a high maximum supply voltage, the product can handle a wide range of power inputs, increasing versatility and robustness.

Address Bus Width: 28

A larger address bus width allows for greater memory addressing capabilities, enabling more complex and data-intensive applications to be executed efficiently.

Package Shape: SQUARE

The square package shape offers uniformity in component layout and can facilitate easier and more efficient PCB design.

Bit Size: 32

With a 32-bit architecture, the product can process larger chunks of data at once, leading to improved performance and speed in processing tasks.

No. of Terminals: 100

A higher number of terminals allows for more connectivity options and peripheral integration, making the product versatile and suitable for a variety of applications.

Package Style: FLATPACK, THIN PROFILE, FINE PITCH

The package style offers a combination of compact size, thin profile, and fine pitch, enhancing the product's suitability for compact and space-constrained designs.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage requirement allows for energy-efficient operation and compatibility with a wide range of power sources.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and corrosion resistance, ensuring reliable connections and longevity of the product.

ADC Channels: YES

The presence of Analog-to-Digital Converter (ADC) channels enables the product to interface with analog sensors and signals, expanding its capability to work with real-world inputs.

DMA Channels: YES

Integrated Direct Memory Access (DMA) channels improve data transfer efficiency and offload the CPU, enhancing overall system performance.

Terminal Position: QUAD

The quad terminal position allows for a secure and stable connection, reducing the risk of signal interference or disconnection.

Width: 14 mm

The compact width of the product makes it suitable for applications where space is limited, offering flexibility in design and installation.

External Data Bus Width: 16

Having a 16-bit external data bus width enables efficient data transfer between the microcontroller and external devices, enhancing performance and data throughput.

Maximum Clock Frequency: 50 MHz

A high maximum clock frequency allows the product to execute instructions at a fast pace, enabling quick response times and efficient processing of tasks.

Maximum Time At Peak Reflow Temperature (s): 40

With a maximum reflow time of 40 seconds, the product can undergo reliable and efficient solder reflow processes during manufacturing, ensuring high-quality assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance of 260°C indicates the product's ability to withstand elevated temperature environments during reflow soldering.

Length: 14 mm

The compact length of the product contributes to its overall small footprint, making it suitable for applications where size constraints are a concern.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller along with integrated peripherals enhances the product's processing efficiency and capability to handle a variety of tasks effectively.

Terminal Form: GULL WING

The gull-wing terminal form provides mechanical stability and ease of soldering during assembly, ensuring secure and reliable connections.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V offers compatibility with common power sources, simplifying the product's integration into existing systems.

PWM Channels: YES

The inclusion of Pulse-Width Modulation (PWM) channels enables the product to generate variable analog signals for controlling motors, LEDs, and other devices.

Terminal Pitch: 0.5 mm

The tight terminal pitch of 0.5 mm allows for high-density mounting, facilitating compact PCB designs and space-efficient layouts.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, the product can withstand moderate exposure to moisture during manufacturing and storage, ensuring operational reliability in various environments.

Speed: 72 rpm

The speed specification of 72 rotations per minute indicates the product's capability to interface with and control external devices or systems requiring precise timing and control.

No. of I/O Lines: 86

Having 86 I/O lines provides ample connectivity options and flexibility for interfacing with external peripherals and devices, making the product versatile in handling diverse input and output requirements.

Technical Specifications

Microcontrollers EFM32GG11B310F2048GQ100-BR attributes and parameters. Explore more Microcontrollers devices from Silicon Labs

Specs

ADC Channels:

YES

Address Bus Width:

28

Bit Size:

32

Maximum Clock Frequency:

50 MHz

DMA Channels:

YES

External Data Bus Width:

16

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

86

No. of Terminals:

100

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Speed:

72 rpm

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Trade Compliance

EFM32GG11B310F2048GQ100-BR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Silicon Labs

Silicon Laboratories, Inc. (Silicon Labs) is a fabless global technology company that designs and manufactures semiconductors, other silicon devices and software, which it sells to electronics design engineers and manufacturers in Internet of Things (IoT) infrastructure worldwide. It is headquartered in Austin, Texas, United States. The company focuses on microcontrollers (MCUs) and wireless system on chips (SoCs) and modules. The company also produces software stacks including firmware libraries and protocol-based software, and a free software development platform called Simplicity Studio. Silicon Labs was founded in 1996 and released its first product, an updated DAA design that enabled manufacturers to reduce the size and cost of a modem, two years later. During its first three years, the company focused on RF and CMOS integration, and developed the world's first CMOS RF synthesizer for mobile phones which was released in 1999. Following the appointment of Tyson Tuttle as the CEO in 2012, Silicon Labs has increasingly focused on developing technologies for the IoT market, which in 2019 accounted for more than 50 percent of the company's revenue, but in 2020 had increased to about 58 percent. In 1998, Silicon Labs released its first product, an updated Direct Access Arrangement (DAA) design that enabled manufacturers to reduce the size and cost of a modem.

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