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JM38510/01403BEB

Signetics

JM38510/01403BEB by Signetics

MULTIPLEXER; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Shape: RECTANGULAR; Qualification: Not Qualified;

Median Price

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Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

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ComSIT Distribution GmbH

Germany . 1,473 parts In-Stock

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Electronic Expediters

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Prism Electronics

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R&J Components

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Resion

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EMSNET

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A2Z Electronics, Inc.

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Electronics Depot

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Odi Ramu Company

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MRC Electronics

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Perfect Parts

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Technical Specifications

Multiplexer & Demultiplexer JM38510/01403BEB attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Signetics

Specs

Family:

TTL/H/L

JESD-30 Code:

R-GDIP-T16

Load Capacitance (CL):

30 pF

Logic IC Type:

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Power Supply Current (ICC):

52 mA

Qualification:

Not Qualified

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

JM38510/01403BEB Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Signetics

Signetics - Philips - NXP Company Overview Signetics, once a major player in semiconductor manufacturing, made a variety of devices which included integrated circuits, bipolar and MOS, the Dolby circuit, logic, memory, analog circuits and Motorola clone CPUs. Signetics was acquired by Philips Semiconductor in 1975. Philips Semiconductors, headquartered in Eindhoven, The Netherlands, is one of the world's top semiconductor suppliers. Our ambition is to be the leading provider of semiconductor-based solutions for connected consumer and communications applications. Philips Semiconductors is a leading supplier of silicon system solutions for mobile communications, consumer electronics, digital displays, contactless payment and connectivity, and in-car entertainment and networking. Philips Semiconductor was spun off from Philips in August, 2006 to form NXP Semiconductors.

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