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2606-1B

Signetics

2606-1B by Signetics

STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 16; Package Shape: RECTANGULAR; Technology: NMOS; Maximum Access Time: 500 ns;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Technical Specifications

SRAM 2606-1B attributes and parameters. Explore more SRAM devices from Signetics

Specs

Maximum Access Time:

500 ns

JESD-30 Code:

R-PDIP-T16

Memory Density:

1024 bit

Memory IC Type:

Memory Width:

4

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

16

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

256X4

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

NMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Trade Compliance

2606-1B Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Signetics

Signetics - Philips - NXP Company Overview Signetics, once a major player in semiconductor manufacturing, made a variety of devices which included integrated circuits, bipolar and MOS, the Dolby circuit, logic, memory, analog circuits and Motorola clone CPUs. Signetics was acquired by Philips Semiconductor in 1975. Philips Semiconductors, headquartered in Eindhoven, The Netherlands, is one of the world's top semiconductor suppliers. Our ambition is to be the leading provider of semiconductor-based solutions for connected consumer and communications applications. Philips Semiconductors is a leading supplier of silicon system solutions for mobile communications, consumer electronics, digital displays, contactless payment and connectivity, and in-car entertainment and networking. Philips Semiconductor was spun off from Philips in August, 2006 to form NXP Semiconductors.

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