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S-93C56BD0I-T8T2G

Seiko Instruments Usa

S-93C56BD0I-T8T2G by Seiko Instruments Usa

EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Technical Specifications

EEPROM S-93C56BD0I-T8T2G attributes and parameters. Explore more EEPROM devices from Seiko Instruments Usa

Specs

Maximum Clock Frequency (fCLK):

2 MHz

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e6

Length:

4.4 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

8

No. of Words:

128 words

No. of Words Code:

128

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128X16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Serial Bus Type:

MICROWIRE

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Maximum Write Cycle Time (tWC):

8 ms

Trade Compliance

S-93C56BD0I-T8T2G Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Seiko Instruments Usa

Seiko Instruments Inc, founded in 1937 as a member of the Seiko Group specializing in the manufacture of watches, has leveraged its core competency in high precision watches to create a wide range of new products and technologies. With the development and manufacturing of watches requiring high accuracy and precision as our base, over the years SII has developed miniature, low-power-consumption electronic components and mechanical precision parts that pride themselves on their submicron processing capability. Optimizing our extensive experience and expertise, we have since diversified into such new fields as printing devices adapted to diverse output needs. The evolution of technology in the environment around us, with things such as IoT, next-generation mobility, and robotics, is bringing about changes in industry and lifestyles. SII, in the years to come, will maintain an uncompromised dedication to its time-honored technologies and innovations of craftsmanship, miniaturization, and efficiency that contribute to the development of our society and enrich the lives of those around us.

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