Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Packing Method: TR, EMBOSSED, 13 INCH; Maximum Forward Current: .025 A; No. of Functions: 1; Maximum Isolation Voltage: 5000 V;
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Optocoupler Circuit Outputs PS9009-F3 attributes and parameters. Explore more Optocoupler Circuit Outputs devices from Renesas Electronics
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PS9009-F3 Optoelectronics trade compliance attributes, and parameters.
HTS
8541.40.80.00
SB
M39029/58360
Souriau-sunbank Connection Technologies
Souriau-sunbank's M39029/58360 is a MIL-Spec backshell with CRIMP contact type and male gender. It conforms to MIL-DTL-38999 standards, mates with M39029/56348 contacts, and requires M81969/14-01 insertion tools. Ideal for military applications requiring reliable crimp terminals.
LM358M
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
2N2222A
Vpt Components
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Maximum Power Dissipation Ambient: .5 W;
SS14
Rfe International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Yangzhou Yangjie Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.05 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
BAV99WT1G
Onsemi
BAV99WT1G by Onsemi is a series connected diode with 0.006 us reverse recovery time. It is a small outline rectifier diode with 70V peak reverse voltage, ideal for surface mount applications in electronics requiring fast switching and low forward voltage drop.
1552200253
Molex
WIRE AND CABLE;
MBR0520LT1G
MBR0520LT1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, has a peak reflow temperature of 260°C, and a repetitive peak reverse voltage of 20V. This diode is ideal for applications requiring high-speed switching in compact electronic devices.
LL4148
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
M24308/2-1F
Bel Fuse
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Mixed Contacts: NO;
Semiconductor Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM555CN
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
OPA2277UA/2K5
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
LL4148-GS08
Telefunken Microelectronics
RECTIFIER DIODE; Surface Mount: YES; JESD-609 Code: e0; No. of Elements: 1; Maximum Operating Temperature: 175 Cel; Maximum Non Repetitive Peak Forward Current: 2 A;
1N4148
Shandong Yiguang Electronic Joint Stock
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM317T
Sgs-ates Componenti Electronici S P A
Other Regulators; No. of Terminals: 3; JESD-609 Code: e0; Terminal Position: SINGLE; Adjustability: ADJUSTABLE; Maximum Load Regulation (%): 1.5 %;
BSS138
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JESD-30 Code: R-PDSO-G3; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Operating Mode: ENHANCEMENT MODE;
Unitrode
LM555CM
Intersil
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
2N7002-7-F
SPC TECHNOLOGY/ MULTICOMP
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Form: GULL WING; Package Shape: RECTANGULAR;
6N136
Vishay Intertechnology
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: THROUGH HOLE MOUNT; Terminal Finish: Matte Tin (Sn); Maximum Forward Current: .025 A; Maximum On State Current: .008 A; Shape: RECTANGULAR;
TLP2366(V4-TPL,E
Toshiba
Toshiba's TLP2366(V4-TPL,E is a single optocoupler with max. forward current of 0.025A and min. supply voltage of 2.7V, ideal for logic IC output applications. With a response time of 40ns, max isolation voltage of 3750V, and data rate of 20MBps, it operates b/w -40 to 125°C in surface mount configurations.
HCPL2601
Rs Components
Optocoupler - IC Outputs; Mounting Feature: THROUGH HOLE MOUNT; Nominal Response Time: 20 ns; Maximum Isolation Voltage: 3000 V; Nominal Supply Voltage: 5 V; No. of Elements: 1;
TLP2770(TP,E(O
Toshiba's TLP2770(TP,E(O optocoupler features 5000V isolation voltage, 20MBps data rate, and -40 to 125°C operating temperature range. Ideal for logic IC output applications requiring fast response time of 1.3ns in a surface mount configuration.
TLP2361(TPL,E(O
Toshiba's TLP2361 optocoupler has a max forward current of 0.01A, isolation voltage of 3750V, and response time of 3ns. Ideal for logic IC output applications with a supply voltage as low as 2.7V, operating b/w -40 to 125°C, and data rate up to 15MBps in surface mount configurations.
HCPL-7721-000E
Broadcom
The Broadcom HCPL-7721-000E is a complex optocoupler with logic IC output. It has a max forward current of 0.00001 A and isolation voltage of 3750 V, suitable for applications requiring high-speed data transmission up to 25 MBps. With a wide operating temperature range from -40°C to 85°C, it is ideal for through-hole mounting in various electronic circuits.
HCPL-315J
Broadcom's HCPL-315J is a complex optocoupler with 2 functions, max forward current of 0.016A, and isolation voltage of 3750V. Ideal for logic IC output applications, it operates b/w -40 to 100°C with a min supply voltage of 15V.
6N139
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: THROUGH HOLE MOUNT; Terminal Finish: Tin/Lead (Sn/Pb); JESD-609 Code: e0; Maximum Power Dissipation: .1 W; Minimum Operating Temperature: 0 Cel;
HCPL2630SD
HCPL2630SD by Onsemi is a 2-channel logic IC output optocoupler with separate configuration. It has a max forward current of 0.03A and operates at temperatures ranging from -40 to 85°C. Ideal for applications requiring high isolation voltage, fast response time, and surface mounting feature.
ACPL-064L-500E
Broadcom's ACPL-064L-500E is a 2-channel optocoupler with separate configuration. It features a max forward current of 0.008A, operating temperature up to 105°C, and isolation voltage of 3750V. Ideal for logic IC output applications requiring fast response time and high power dissipation in surface mount setups.
HCPL-3120-500E
Agilent Technologies
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; No. of Functions: 1; No. of Elements: 1; Maximum Forward Current: .016 A; Minimum Supply Voltage: 15 V;
Vishay Telefunken
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: THROUGH HOLE MOUNT; No. of Elements: 1; No. of Functions: 1; Nominal Data Rate: 1 MBps; Nominal Response Time: 30 ns;
H11L1SM
The Onsemi H11L1SM is a single optocoupler with a max forward current of 0.06A and isolation voltage of 7500V. It operates b/w -40 to 85°C, suitable for logic IC output applications at data rates up to 1MBps. With a matte tin finish and surface mount feature, it offers reliable performance in various electronic circuits.
HCPL-2212-300E
Optocoupler - IC Outputs; Mounting Feature: SURFACE MOUNT; Maximum Operating Temperature: 85 Cel; No. of Elements: 1; Nominal Response Time: 300 ns; Maximum Forward Current: .01 A;
HCPL2531S
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Maximum Isolation Voltage: 2500 V; No. of Functions: 2; Maximum Forward Current: .025 A; Configuration: SEPARATE, 2 CHANNELS;
6N137
Qt Optoelectronics
LOGIC IC OUTPUT OPTOCOUPLER; Terminal Finish: Tin/Lead (Sn/Pb); No. of Elements: 1; Additional Features: UL RECOGNIZED; Maximum On State Current: .05 A; Maximum Forward Current: .05 A;
HCPL0731R2
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: Matte Tin (Sn); Configuration: SEPARATE, 2 CHANNELS; Additional Features: UL RECOGNIZED; No. of Elements: 2;
HCPL2631WV
LOGIC IC OUTPUT OPTOCOUPLER; Nominal Data Rate: 10 MBps; Additional Features: CMOS COMPATIBLE, OPEN COLLECTOR, UL RECOGNIZED, VDE APPROVED; No. of Functions: 2; Minimum Supply Voltage: 4.5 V; Maximum Forward Current: .03 A;
FODM611R2
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: Matte Tin (Sn); Nominal Data Rate: 10 MBps; Nominal Response Time: 100 ns; Maximum Isolation Voltage: 3750 V;
6N139SVM
LOGIC IC OUTPUT OPTOCOUPLER; No. of Elements: 1; Maximum Isolation Voltage: 5000 V; Configuration: SINGLE; Maximum On State Current: .06 A; Maximum Forward Current: .02 A;
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PS9013-Y-V-AX
Renesas Electronics
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: NICKEL PALLADIUM GOLD; Maximum Isolation Voltage: 5000 V; JESD-609 Code: e4; No. of Elements: 1;
PS9009-Y-V-AX
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: NICKEL PALLADIUM GOLD; Minimum Supply Voltage: 4.5 V; Packing Method: TAPE; Maximum Forward Current: .025 A;
PS9009
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Maximum Isolation Voltage: 5000 V; Maximum Forward Current: .025 A; No. of Elements: 1; No. of Functions: 1;
PS9013-Y-AX
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: NICKEL PALLADIUM GOLD; No. of Elements: 1; Maximum Operating Temperature: 125 Cel; Minimum Operating Temperature: -40 Cel;
PS9013
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Minimum Operating Temperature: -40 Cel; Packing Method: TAPE; No. of Elements: 1; Minimum Supply Voltage: 4.5 V;
PS9009-Y-AX
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: NICKEL PALLADIUM GOLD; Maximum Operating Temperature: 125 Cel; Maximum Forward Current: .025 A; Additional Features: UL APPROVED, OPEN COLLECTOR;
PS9013-Y-V-F3-AX
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: NICKEL PALLADIUM GOLD; JESD-609 Code: e4; Minimum Operating Temperature: -40 Cel; Configuration: SINGLE;
PS9001-Y-F3-AX
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: NICKEL PALLADIUM GOLD; No. of Functions: 1; Maximum Isolation Voltage: 5000 V; Packing Method: TR, EMBOSSED, 13 INCH;
PS9009-Y-V-F3-AX
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: NICKEL PALLADIUM GOLD; No. of Elements: 1; Minimum Supply Voltage: 4.5 V; Nominal Response Time: 25 ns;
PS9013-V-F3
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Configuration: SINGLE; Minimum Supply Voltage: 4.5 V; Packing Method: TR, EMBOSSED, 13 INCH; No. of Functions: 1;
PS9013-F3
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Additional Features: UL APPROVED; Configuration: SINGLE; Maximum Operating Temperature: 125 Cel; Minimum Operating Temperature: -40 Cel;
PS9009-V-F3
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Configuration: SINGLE; Packing Method: TR, EMBOSSED, 13 INCH; Nominal Response Time: 25 ns; Maximum Operating Temperature: 125 Cel;
PS9013-Y-F3-AX
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: NICKEL PALLADIUM GOLD; Minimum Operating Temperature: -40 Cel; Nominal Data Rate: 1 MBps; JESD-609 Code: e4;
PS9001-Y-V-F3-AX
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: NICKEL PALLADIUM GOLD; Maximum Operating Temperature: 125 Cel; Maximum On State Current: .02 A; Nominal Data Rate: 10 MBps;
PS9009-Y-F3-AX
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: NICKEL PALLADIUM GOLD; Maximum On State Current: .025 A; No. of Elements: 1; Minimum Supply Voltage: 4.5 V;
PS9001-Y-AX
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: NICKEL PALLADIUM GOLD; Maximum Forward Current: .025 A; JESD-609 Code: e4; Minimum Supply Voltage: 4.5 V;
PS9001-Y-V-AX
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: NICKEL PALLADIUM GOLD; Packing Method: TAPE; Minimum Supply Voltage: 4.5 V; Maximum Operating Temperature: 125 Cel;
PS9009-V
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; No. of Functions: 1; Nominal Response Time: 25 ns; No. of Elements: 1; Minimum Operating Temperature: -40 Cel;
PS9013-V
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Maximum Operating Temperature: 125 Cel; Additional Features: UL APPROVED, VDE APPROVED; Minimum Operating Temperature: -40 Cel; Packing Method: TAPE;
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