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5962-8851802LA

Qp Semiconductor

5962-8851802LA by Qp Semiconductor

OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Organization: 512X8;

Median Price

$44.938

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

5962-8851802LA by Qp Semiconductor
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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 8 parts In-Stock

1+ parts

$44.938

100+ parts

-

1k+ parts

-

10k+ parts

-

8

$44.938

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-

-

Mil-Aero Solutions, Inc.

USA . 6 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6

-

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Technical Specifications

OTP ROM 5962-8851802LA attributes and parameters. Explore more OTP ROM devices from Qp Semiconductor

Specs

JESD-30 Code:

R-GDIP-T24

JESD-609 Code:

e0

Length:

31.877 mm

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

24

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

512X8

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

5962-8851802LA Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Qp Semiconductor

P Semiconductor is a privately held California company incorporated in October 1985. QP Semiconductor was formed initially to provide semiconductor assembly, electrical test and qualification services to the military, aerospace and high reliability industries. The company has since evolved into a true fabless semiconductor company with a complete range of manufacturing capability by establishing product design and fab foundry relationships to complement its assembly, test and qualification capability. The products and services offered, focus on providing total parts solutions for DMS, (Diminished Manufacturing Sources) and EOL (End of Life) semiconductor components to the military, aerospace and high reliability markets. QP Semiconductor was acquired by British company e2v in October, 2008.

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