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TEA1062ATD-T

Philips Semiconductors

TEA1062ATD-T by Philips Semiconductors

Telephone Circuits; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;

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One Stop Electronics

USA . 1,204 parts In-Stock

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Spain . 7,797 parts In-Stock

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USA . 4,479 parts In-Stock

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Technical Specifications

Telephone Line ICs TEA1062ATD-T attributes and parameters. Explore more Telephone Line ICs devices from Philips Semiconductors

Specs

JESD-30 Code:

R-PDSO-G16

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.4

Qualification:

Not Qualified

Sub-Category:

Telephone Circuits

Maximum Supply Current:

1.35 mA

Nominal Supply Voltage:

3.4 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Manufacturer Highlights

Philips Semiconductors

In September 2006, Philips completed the sale of an 80.1% stake in Philips Semiconductors to a consortium of private equity investors consisting of KKR, Bain Capital, Silver Lake Partners, Apax Partners and AlpInvest Partners. The new company name NXP (from Next eXPerience) was announced on August 31, 2006, and the company was officially launched during the Internationale Funkausstellung (IFA) consumer electronics show in Berlin. The newly independent NXP was ranked as one of the world's top 10 semiconductor companies

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