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TDA5732M

Philips Semiconductors

TDA5732M by Philips Semiconductors

RF/Microwave Mixers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Package Equivalence Code: SSOP20,.25;

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,414 parts In-Stock

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Anansix

USA . 1,290 parts In-Stock

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1,290

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Digiode

USA . 1,238 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,533 parts In-Stock

1+ parts

$18.800

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$18.800

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UNI Independent Distributors

Spain . 5,783 parts In-Stock

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5,783

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Corphita

USA . 2,389 parts In-Stock

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2,389

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Technical Specifications

RF/Microwave Mixers TDA5732M attributes and parameters. Explore more RF/Microwave Mixers devices from Philips Semiconductors

Specs

JESD-609 Code:

e0

Mounting Feature:

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

Package Equivalence Code:

SSOP20,.25

Power Supplies (V):

5

Sub-Category:

RF/Microwave Mixers

Maximum Supply Current:

64 mA

Technology:

Terminal Finish:

Tin/Lead (Sn/Pb)

Manufacturer Highlights

Philips Semiconductors

In September 2006, Philips completed the sale of an 80.1% stake in Philips Semiconductors to a consortium of private equity investors consisting of KKR, Bain Capital, Silver Lake Partners, Apax Partners and AlpInvest Partners. The new company name NXP (from Next eXPerience) was announced on August 31, 2006, and the company was officially launched during the Internationale Funkausstellung (IFA) consumer electronics show in Berlin. The newly independent NXP was ranked as one of the world's top 10 semiconductor companies

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