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PCA8581P

Philips Semiconductors

PCA8581P by Philips Semiconductors

EEPROM; Temperature Grade: OTHER; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Technology: CMOS;

Median Price

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Lifecycle Status

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In-Stock Inventory

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Vyrian

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Digiode

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Anansix

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J2 Sourcing AB

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Zilex Electronics Inc.

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ComSIT Distribution GmbH

Germany . 665 parts In-Stock

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Corel Iberica Componentes, S.L.

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Digital Electronic Gebert Verwaltungs UG

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Q Components

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Fibra_Brandt Electronic GMBH

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Mil-Aero Solutions, Inc.

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One Stop Electronics

USA . 226 parts In-Stock

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Authorized Procurement Solutions

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Kepictronics

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Corphita

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Assy Fe

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Technical Specifications

EEPROM PCA8581P attributes and parameters. Explore more EEPROM devices from Philips Semiconductors

Specs

Minimum Data Retention Time:

10

Endurance:

10000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e4

Memory Density:

1024 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

8

No. of Words:

128 words

No. of Words Code:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Organization:

128X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

SERIAL

Power Supplies (V):

5

Qualification:

Not Qualified

Serial Bus Type:

I2C

Maximum Standby Current:

.00001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

1 mA

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

PCA8581P Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Philips Semiconductors

In September 2006, Philips completed the sale of an 80.1% stake in Philips Semiconductors to a consortium of private equity investors consisting of KKR, Bain Capital, Silver Lake Partners, Apax Partners and AlpInvest Partners. The new company name NXP (from Next eXPerience) was announced on August 31, 2006, and the company was officially launched during the Internationale Funkausstellung (IFA) consumer electronics show in Berlin. The newly independent NXP was ranked as one of the world's top 10 semiconductor companies

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