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HEF40097BD

Philips Semiconductors

HEF40097BD by Philips Semiconductors

BUS DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

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Anansix

USA . 1,474 parts In-Stock

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Vyrian

USA . 750 parts In-Stock

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750

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Digiode

USA . 558 parts In-Stock

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Manotoh

Italy . 100 parts In-Stock

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Pegasus Components GmbH

Germany . 100 parts In-Stock

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ABC Electronics Ltd.

UK . 41 parts In-Stock

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Huijzer Components

Netherlands . 25 parts In-Stock

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LWI Electronics Inc

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Distributors (Availability)

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One Stop Electronics

USA . 1,602 parts In-Stock

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$20.000

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Andel Nordic

Denmark . 425 parts In-Stock

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$44.180

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$30.929

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$30.929

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Native Components

USA . 74 parts In-Stock

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$154.320

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$148.147

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Northwest PG Solutions

USA . 116 parts In-Stock

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$169.752

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UNI Independent Distributors

Spain . 7,286 parts In-Stock

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Corphita

USA . 1,577 parts In-Stock

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Infinite Electronics LLP (Excess)

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Technical Specifications

Bus Driver & Transceivers HEF40097BD attributes and parameters. Explore more Bus Driver & Transceivers devices from Philips Semiconductors

Specs

Control Type:

ENABLE LOW

JESD-30 Code:

R-XDIP-T16

JESD-609 Code:

e0

Logic IC Type:

Maximum I (ol):

2.3 Amp

No. of Bits:

6

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Power Supply Current (ICC):

.12 mA

Propagation Delay At Nominal Supply:

140 ns

Qualification:

Not Qualified

Sub-Category:

Bus Driver/Transceivers

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

HEF40097BD Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-25-133-2443, 5962251332443

NIIN

251332443

Manufacturer Highlights

Philips Semiconductors

In September 2006, Philips completed the sale of an 80.1% stake in Philips Semiconductors to a consortium of private equity investors consisting of KKR, Bain Capital, Silver Lake Partners, Apax Partners and AlpInvest Partners. The new company name NXP (from Next eXPerience) was announced on August 31, 2006, and the company was officially launched during the Internationale Funkausstellung (IFA) consumer electronics show in Berlin. The newly independent NXP was ranked as one of the world's top 10 semiconductor companies

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