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BGX881

Philips Semiconductors

BGX881 by Philips Semiconductors

RF/Microwave Amplifiers; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Minimum Operating Temperature: -20 Cel; Package Equivalence Code: MOT CASE 714B; Maximum Operating Temperature: 100 Cel;

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,844 parts In-Stock

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Anansix

USA . 2,534 parts In-Stock

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Vyrian

USA . 196 parts In-Stock

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Manotoh

Italy . 1 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 44 parts In-Stock

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$0.712

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44

$0.712

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Northwest PG Solutions

USA . 855 parts In-Stock

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$0.783

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855

$0.783

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One Stop Electronics

USA . 178 parts In-Stock

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$27.000

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178

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UNI Independent Distributors

Spain . 3,425 parts In-Stock

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Corphita

USA . 116 parts In-Stock

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Technical Specifications

RF & Microwave Amplifiers BGX881 attributes and parameters. Explore more RF & Microwave Amplifiers devices from Philips Semiconductors

Specs

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

Package Equivalence Code:

MOT CASE 714B

Power Supplies (V):

24

Sub-Category:

RF/Microwave Amplifiers

Maximum Supply Current:

240 mA

Technology:

Manufacturer Highlights

Philips Semiconductors

In September 2006, Philips completed the sale of an 80.1% stake in Philips Semiconductors to a consortium of private equity investors consisting of KKR, Bain Capital, Silver Lake Partners, Apax Partners and AlpInvest Partners. The new company name NXP (from Next eXPerience) was announced on August 31, 2006, and the company was officially launched during the Internationale Funkausstellung (IFA) consumer electronics show in Berlin. The newly independent NXP was ranked as one of the world's top 10 semiconductor companies

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