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BGD702

Philips Semiconductors

BGD702 by Philips Semiconductors

RF/Microwave Amplifiers; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Maximum Operating Temperature: 100 Cel; Power Supplies (V): 24; Package Equivalence Code: SOT-115J;

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Lifecycle Status

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8

In-Stock Inventory

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Vyrian

USA . 3,775 parts In-Stock

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Digiode

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Anansix

USA . 782 parts In-Stock

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Q Components

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Connector Distribution Corp

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Right Parts Inc.

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Prism Electronics

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A2Z Electronics, Inc.

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One Stop Electronics

USA . 1,178 parts In-Stock

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UNI Independent Distributors

Spain . 5,796 parts In-Stock

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Corphita

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Northwest PG Solutions

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Native Components

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Technical Specifications

RF & Microwave Amplifiers BGD702 attributes and parameters. Explore more RF & Microwave Amplifiers devices from Philips Semiconductors

Specs

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

Package Equivalence Code:

SOT-115J

Power Supplies (V):

24

Sub-Category:

RF/Microwave Amplifiers

Maximum Supply Current:

435 mA

Technology:

Manufacturer Highlights

Philips Semiconductors

In September 2006, Philips completed the sale of an 80.1% stake in Philips Semiconductors to a consortium of private equity investors consisting of KKR, Bain Capital, Silver Lake Partners, Apax Partners and AlpInvest Partners. The new company name NXP (from Next eXPerience) was announced on August 31, 2006, and the company was officially launched during the Internationale Funkausstellung (IFA) consumer electronics show in Berlin. The newly independent NXP was ranked as one of the world's top 10 semiconductor companies

Category top products 20

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