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74LVC1G66GV

Philips Semiconductors

74LVC1G66GV by Philips Semiconductors

SPST; Temperature Grade: AUTOMOTIVE; No. of Terminals: 5; Package Code: TSOP; Package Shape: RECTANGULAR; Surface Mount: YES;

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8

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Chip Stock

USA . 132,500 parts In-Stock

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Vyrian

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Bristol Electronics

USA . 6,000 parts In-Stock

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Dan-Mar Components

USA . 6,000 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,812 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 2,623 parts In-Stock

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Anansix

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Digiode

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AZTECH Wire

Italy . 11,819 parts In-Stock

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$3.670

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Andel Nordic

Denmark . 3,932 parts In-Stock

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$8.139

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$7.813

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One Stop Electronics

USA . 653 parts In-Stock

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A-Z Elektronik GmbH

Germany . 8,300 parts In-Stock

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UNI Independent Distributors

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Perfect Parts

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iodParts Technologies Inc.

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Assy Fe

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Corphita

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Supply Digital

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Northwest PG Solutions

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Native Components

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Kepictronics

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Cyclops Electronics Ltd (Excess)

UK . 50 parts In-Stock

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Technical Specifications

Multiplexers & Switches 74LVC1G66GV attributes and parameters. Explore more Multiplexers & Switches devices from Philips Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO

No. of Functions:

1

No. of Terminals:

5

Maximum On-state Resistance (Ron):

150 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Switching (V):

MAKE-BEFORE-BREAK

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Trade Compliance

74LVC1G66GV Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Philips Semiconductors

In September 2006, Philips completed the sale of an 80.1% stake in Philips Semiconductors to a consortium of private equity investors consisting of KKR, Bain Capital, Silver Lake Partners, Apax Partners and AlpInvest Partners. The new company name NXP (from Next eXPerience) was announced on August 31, 2006, and the company was officially launched during the Internationale Funkausstellung (IFA) consumer electronics show in Berlin. The newly independent NXP was ranked as one of the world's top 10 semiconductor companies

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