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74HC7540D

Philips Semiconductors

74HC7540D by Philips Semiconductors

BUS DRIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;

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Chip Stock

USA . 3,596 parts In-Stock

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Vyrian

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Bristol Electronics

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Huijzer Components

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Anansix

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LittleDiode

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Pegasus Components GmbH

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J2 Sourcing AB

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Distributors (Availability)

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Andel Nordic

Denmark . 3,197 parts In-Stock

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$4.153

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AZTECH Wire

Italy . 8,096 parts In-Stock

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Native Components

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One Stop Electronics

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Component Stockers USA

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Corphita

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Northwest PG Solutions

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Supply Digital

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Infinite Electronics LLP (Excess)

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UNI Independent Distributors

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Perfect Parts

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Kepictronics

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Technical Specifications

Bus Driver & Transceivers 74HC7540D attributes and parameters. Explore more Bus Driver & Transceivers devices from Philips Semiconductors

Specs

Control Type:

ENABLE LOW

JESD-30 Code:

R-PDSO-G20

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

36 ns

Qualification:

Not Qualified

Sub-Category:

Bus Driver/Transceivers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

74HC7540D Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Philips Semiconductors

In September 2006, Philips completed the sale of an 80.1% stake in Philips Semiconductors to a consortium of private equity investors consisting of KKR, Bain Capital, Silver Lake Partners, Apax Partners and AlpInvest Partners. The new company name NXP (from Next eXPerience) was announced on August 31, 2006, and the company was officially launched during the Internationale Funkausstellung (IFA) consumer electronics show in Berlin. The newly independent NXP was ranked as one of the world's top 10 semiconductor companies

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