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74AUP1G126GW

Philips Semiconductors

74AUP1G126GW by Philips Semiconductors

BUS DRIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 5; Package Code: TSSOP; Package Shape: RECTANGULAR;

Median Price

$1.150

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 20 parts In-Stock

1+ parts

$1.150

100+ parts

$0.870

1k+ parts

$0.750

10k+ parts

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20

$1.150

$0.870

$0.750

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Cyclops Electronics Ltd

UK . 12,000 parts In-Stock

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12,000

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Digiode

USA . 3,721 parts In-Stock

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3,721

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Vyrian

USA . 3,090 parts In-Stock

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Anansix

USA . 464 parts In-Stock

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464

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Distributors (Availability)

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AZTECH Wire

Italy . 4,766 parts In-Stock

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$1.150

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Andel Nordic

Denmark . 2,921 parts In-Stock

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$3.990

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$3.830

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$3.830

2,921

$3.990

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$3.830

$3.830

One Stop Electronics

USA . 1,159 parts In-Stock

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$46.000

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1,159

$46.000

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Kepictronics

USA . 13,500 parts In-Stock

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13,500

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A-Z Elektronik GmbH

Germany . 12,256 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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UNI Independent Distributors

Spain . 3,945 parts In-Stock

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Corphita

USA . 3,700 parts In-Stock

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3,700

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Glotronic Ltd.

UK . 2,900 parts In-Stock

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2,900

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Supply Digital

USA . 1,723 parts In-Stock

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Northwest PG Solutions

USA . 572 parts In-Stock

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572

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Native Components

USA . 340 parts In-Stock

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340

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Technical Specifications

Bus Driver & Transceivers 74AUP1G126GW attributes and parameters. Explore more Bus Driver & Transceivers devices from Philips Semiconductors

Specs

Control Type:

ENABLE HIGH

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e0

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

1.7 Amp

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

24 ns

Qualification:

Not Qualified

Sub-Category:

Bus Driver/Transceivers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

74AUP1G126GW Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Philips Semiconductors

In September 2006, Philips completed the sale of an 80.1% stake in Philips Semiconductors to a consortium of private equity investors consisting of KKR, Bain Capital, Silver Lake Partners, Apax Partners and AlpInvest Partners. The new company name NXP (from Next eXPerience) was announced on August 31, 2006, and the company was officially launched during the Internationale Funkausstellung (IFA) consumer electronics show in Berlin. The newly independent NXP was ranked as one of the world's top 10 semiconductor companies

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