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602/BPA

Philips Semiconductors

602/BPA by Philips Semiconductors

RF/Microwave Mixers; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 8; Package Body Material: CERAMIC; Technology: BIPOLAR; Screening Level: 38535Q/M;38534H;883B;

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Anansix

USA . 2,827 parts In-Stock

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2,827

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Digiode

USA . 539 parts In-Stock

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539

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Vyrian

USA . 193 parts In-Stock

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193

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Distributors (Availability)

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One Stop Electronics

USA . 830 parts In-Stock

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$30.000

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830

$30.000

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UNI Independent Distributors

Spain . 6,780 parts In-Stock

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6,780

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Corphita

USA . 3,848 parts In-Stock

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3,848

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Native Components

USA . 650 parts In-Stock

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650

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Northwest PG Solutions

USA . 268 parts In-Stock

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268

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Technical Specifications

RF/Microwave Mixers 602/BPA attributes and parameters. Explore more RF/Microwave Mixers devices from Philips Semiconductors

Specs

JESD-609 Code:

e0

Mounting Feature:

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

Package Equivalence Code:

DIP8,.3

Power Supplies (V):

6

Screening Level:

Sub-Category:

RF/Microwave Mixers

Maximum Supply Current:

4 mA

Technology:

Terminal Finish:

Tin/Lead (Sn/Pb)

Manufacturer Highlights

Philips Semiconductors

In September 2006, Philips completed the sale of an 80.1% stake in Philips Semiconductors to a consortium of private equity investors consisting of KKR, Bain Capital, Silver Lake Partners, Apax Partners and AlpInvest Partners. The new company name NXP (from Next eXPerience) was announced on August 31, 2006, and the company was officially launched during the Internationale Funkausstellung (IFA) consumer electronics show in Berlin. The newly independent NXP was ranked as one of the world's top 10 semiconductor companies

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