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TLV431BSNT1

Onsemi

TLV431BSNT1 by Onsemi

TLV431BSNT1 by Onsemi is a voltage reference IC with adjustable output (1.228-1.252V) and max current of 0.02A. It has a small outline package suitable for industrial applications, operating b/w -40 to 85 °C. Ideal for precision voltage regulation in compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,165 parts In-Stock

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Digiode

USA . 1,224 parts In-Stock

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1,224

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,434 parts In-Stock

1+ parts

$5.500

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1,434

$5.500

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AZTECH Wire

Italy . 1,177 parts In-Stock

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$20.450

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RC Electronics

USA . 20,000 parts In-Stock

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20,000

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TANS Electronics

Latvia . 8,115 parts In-Stock

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8,115

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Problanco Electronics

Mexico . 4,879 parts In-Stock

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4,879

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SupplyDigital Components

Austria . 2,179 parts In-Stock

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2,179

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Kulean Microsystems

USA . 598 parts In-Stock

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Corohmni

South Africa . 382 parts In-Stock

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382

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Microchip USA

USA . 128 parts In-Stock

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128

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Corphita

USA . 51 parts In-Stock

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UHIMA Technologies

Türkiye . 40 parts In-Stock

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Overview

Discover the reliable and versatile TLV431BSNT1 by Onsemi, a top-quality voltage reference designed to meet your precision needs. With a reputation for excellence in manufacturing, Onsemi delivers a product that exceeds expectations. Ideal for a wide range of applications, this voltage reference offers unmatched value and benefits to customers seeking consistent performance and accuracy. Upgrade your projects with the TLV431BSNT1 and experience the advantage of superior quality and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making the product reliable for long-term use.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Trim or Adjustable Output (V): YES

Enables customization of the output voltage as per specific requirements, offering flexibility in various applications.

Maximum Operating Temperature: 85 °C

This high maximum operating temperature ensures the product can withstand harsh environmental conditions, increasing its versatility.

Minimum Output Voltage: 1.228 V

Provides a stable minimum output voltage, ensuring consistent performance of connected devices.

Terminal Finish: TIN LEAD

The tin lead finish on the terminals enhances conductivity and solderability, maintaining a secure connection with the circuit.

Width (mm): 1.5 mm

The compact width of the package saves space on the circuit board, making it suitable for applications with limited real estate.

Nominal Output Voltage: 1.24 V

The precise nominal output voltage ensures accurate reference voltage for the connected circuit, leading to reliable performance.

Technical Specifications

Voltage References TLV431BSNT1 attributes and parameters. Explore more Voltage References devices from Onsemi

Specs

Additional Features:

OUTPUT CAN BE ADJUSTED FROM 1.24V TO 16V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e0

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.02 A

Maximum Output Voltage:

1.252 V

Minimum Output Voltage:

1.228 V

Nominal Output Voltage:

1.24 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Voltage References

Surface Mount:

YES

Technology:

BIPOLAR

Max Voltage Temp Coef:

129.032 ppm/Cel

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Trim or Adjustable Output (V):

YES

Width (mm):

1.5 mm

Trade Compliance

TLV431BSNT1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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