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TIP106G

Onsemi

TIP106G by Onsemi

TIP106G by Onsemi is a PNP power BJT with 80V VCEO, 8A IC, and 200 hFE. It features a Darlington configuration with built-in diode and resistor, ideal for amplifier applications. The transistor has a max power dissipation of 80W and operates up to 150 °C temperature in a rectangular package style.

Median Price

$0.862

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 507 parts In-Stock

1+ parts

$0.470

100+ parts

$0.460

1k+ parts

$0.450

10k+ parts

-

507

$0.470

$0.460

$0.450

-

Farnell

UK . 565 parts In-Stock

1+ parts

$0.747

100+ parts

-

1k+ parts

-

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565

$0.747

-

-

-

Newark

USA . 550 parts In-Stock

1+ parts

$0.976

100+ parts

$0.554

1k+ parts

$0.432

10k+ parts

$0.351

550

$0.976

$0.554

$0.432

$0.351

Adafruit Industries

USA . 2,000 parts In-Stock

1+ parts

$2.047

100+ parts

$1.863

1k+ parts

$1.679

10k+ parts

-

2,000

$2.047

$1.863

$1.679

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 185 parts In-Stock

1+ parts

$0.545

100+ parts

-

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185

$0.545

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TME

Poland . 370 parts In-Stock

1+ parts

$0.760

100+ parts

$0.420

1k+ parts

$0.380

10k+ parts

-

370

$0.760

$0.420

$0.380

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DF Sales Co.

USA . 50 parts In-Stock

1+ parts

$5.000

100+ parts

-

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-

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50

$5.000

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-

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DF Sales Co.

USA . 50 parts In-Stock

1+ parts

$5.000

100+ parts

-

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-

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50

$5.000

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Vyrian

USA . 7,370 parts In-Stock

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-

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7,370

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Inventory MP

USA . 32 parts In-Stock

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32

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Bristol Electronics

USA . 32 parts In-Stock

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32

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Semi Source

USA . 15 parts In-Stock

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15

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Distributors (Availability)

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Corphita

USA . 110 parts In-Stock

1+ parts

$0.517

100+ parts

-

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110

$0.517

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-

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Component Stockers USA

USA . 39 parts In-Stock

1+ parts

$0.550

100+ parts

-

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39

$0.550

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Corohmni

South Africa . 377 parts In-Stock

1+ parts

$0.574

100+ parts

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377

$0.574

-

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$2.047

100+ parts

$1.863

1k+ parts

$1.679

10k+ parts

-

2,000

$2.047

$1.863

$1.679

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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Kepictronics

USA . 7,500 parts In-Stock

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7,500

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SupplyDigital Components

Austria . 5,777 parts In-Stock

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5,777

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Problanco Electronics

Mexico . 2,367 parts In-Stock

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2,367

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Lixinc

USA . 2,287 parts In-Stock

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2,287

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TANS Electronics

Latvia . 1,947 parts In-Stock

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1,947

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Kulean Microsystems

USA . 902 parts In-Stock

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902

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Perfect Parts

USA . 709 parts In-Stock

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709

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UHIMA Technologies

Türkiye . 64 parts In-Stock

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64

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Overview

Elevate your amplifier projects with the TIP106G from Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Bipolar Junction Transistors that are built to last. The TIP106G features a Darlington configuration with a built-in diode and resistor, offering superior performance and reliability. Whether you're working on audio systems or industrial applications, this transistor is designed to meet your needs. Trust Onsemi for exceptional products that provide value, benefits, and advantages to customers like you.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides durability and protection for the transistor, ensuring long-lasting performance.

Polarity or Channel Type: PNP

PNP type transistors are commonly used in amplifiers and switching applications, making this transistor suitable for such purposes.

Configuration: DARLINGTON WITH BUILT-IN DIODE AND RESISTOR

The Darlington configuration along with the built-in diode and resistor simplifies circuit design and reduces the need for additional components.

Transistor Application: AMPLIFIER

Designed for amplifier applications, this transistor provides good amplification and signal processing capabilities.

Maximum Power Dissipation (Abs): 80 W

High power dissipation capability of 80 W allows for handling of high power loads without overheating, making it suitable for demanding applications.

Package Shape: RECTANGULAR

Rectangular package shape provides easy mounting and fitting in circuit layouts, enhancing convenience during installation.

Terminal Form: THROUGH-HOLE

Through-hole terminal form offers secure and reliable connections on PCBs, ensuring stability and longevity of the transistor in the circuit.

No. of Terminals: 3

Three terminals make it easy to connect the transistor in a circuit, allowing for simple and efficient setup.

Maximum Collector-Emitter Voltage: 80 V

High collector-emitter voltage rating of 80 V ensures safe and reliable operation in voltage-sensitive applications.

Maximum Collector Current (IC): 8 A

With a collector current rating of 8 A, this transistor can handle high current loads, making it suitable for power applications.

Technical Specifications

Power Bipolar Junction Transistors (BJT) TIP106G attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

8 A

Maximum Collector-Emitter Voltage:

80 V

Minimum DC Current Gain (hFE):

200

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

PNP

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

TIP106G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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