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TIP101G

Onsemi

TIP101G by Onsemi

TIP101G by Onsemi is a NPN BJT with Darlington configuration, ideal for amplifier applications. It has a max power dissipation of 80W, hFE of 200, and max collector current of 8A. With a max operating temp of 150°C and VCE of 80V, it's suitable for various power control circuits.

Median Price

$0.834

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 2,500 parts In-Stock

1+ parts

$1.012

100+ parts

$0.921

1k+ parts

$0.830

10k+ parts

-

2,500

$1.012

$0.921

$0.830

-

Flip Electronics (Authorized)

USA . 380 parts In-Stock

1+ parts

-

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-

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380

-

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Rochester

USA . 35 parts In-Stock

1+ parts

-

100+ parts

$0.657

1k+ parts

$0.545

10k+ parts

$0.486

35

-

$0.657

$0.545

$0.486

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.328

100+ parts

-

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50

$0.328

-

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Digiode

USA . 923 parts In-Stock

1+ parts

$0.512

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-

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923

$0.512

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-

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TME

Poland . 65 parts In-Stock

1+ parts

$1.170

100+ parts

$0.636

1k+ parts

$0.585

10k+ parts

-

65

$1.170

$0.636

$0.585

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Vyrian

USA . 6,471 parts In-Stock

1+ parts

-

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6,471

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Chip Stock

USA . 3,163 parts In-Stock

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3,163

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Flip Electronics

USA . 380 parts In-Stock

1+ parts

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380

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Prism Electronics

USA . 11 parts In-Stock

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11

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 358 parts In-Stock

1+ parts

$0.321

100+ parts

-

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-

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358

$0.321

-

-

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Continental Prestige Electronics

USA . 4,399 parts In-Stock

1+ parts

$0.328

100+ parts

-

1k+ parts

-

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$0.321

4,399

$0.328

-

-

$0.321

Argo Parts USA

USA . 2,394 parts In-Stock

1+ parts

$0.328

100+ parts

-

1k+ parts

-

10k+ parts

$0.318

2,394

$0.328

-

-

$0.318

Netroflash

USA . 100 parts In-Stock

1+ parts

$0.328

100+ parts

-

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100

$0.328

-

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Semicontronic

India . 898 parts In-Stock

1+ parts

$0.458

100+ parts

$0.447

1k+ parts

$0.444

10k+ parts

-

898

$0.458

$0.447

$0.444

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Ampacity Inc.

Singapore . 521 parts In-Stock

1+ parts

$0.458

100+ parts

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521

$0.458

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Corphita

USA . 1,336 parts In-Stock

1+ parts

$0.485

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1,336

$0.485

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Aztec Data Supply Inc.

USA . 3,245 parts In-Stock

1+ parts

$0.757

100+ parts

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3,245

$0.757

-

-

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$1.012

100+ parts

$0.921

1k+ parts

$0.830

10k+ parts

-

2,500

$1.012

$0.921

$0.830

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AZTECH Wire

Italy . 696 parts In-Stock

1+ parts

$10.390

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696

$10.390

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Lixinc

USA . 9,900 parts In-Stock

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9,900

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TANS Electronics

Latvia . 7,872 parts In-Stock

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SupplyDigital Components

Austria . 7,621 parts In-Stock

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7,621

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Kulean Microsystems

USA . 6,482 parts In-Stock

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6,482

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Perfect Parts

USA . 4,097 parts In-Stock

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4,097

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Problanco Electronics

Mexico . 3,488 parts In-Stock

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3,488

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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RC Electronics

USA . 2,610 parts In-Stock

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$0.340

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$0.330

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$0.320

2,610

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$0.340

$0.330

$0.320

Kepictronics

USA . 1,400 parts In-Stock

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1,400

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UHIMA Technologies

Türkiye . 192 parts In-Stock

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192

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Overview

Enhance your electronic projects with the TIP101G by Onsemi, a high-quality Power BJT that offers exceptional performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this NPN transistor with Darlington configuration is ideal for amplifier applications. With a maximum power dissipation of 80W and a DC current gain of 200, the TIP101G provides superior functionality. Upgrade your projects with ease using this versatile component that guarantees top-notch results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes the transistor lightweight and durable, suitable for various applications.

Polarity or Channel Type: NPN

NPN type transistors are commonly used in amplification circuits, making this transistor suitable for amplifier applications.

Configuration: DARLINGTON WITH BUILT-IN DIODE AND RESISTOR

The Darlington configuration provides high current gain, while the built-in diode and resistor offer added functionality and convenience in circuit design.

Transistor Application: AMPLIFIER

Specifically designed for amplifier applications, ensuring optimal performance in amplification circuits.

Maximum Power Dissipation (Abs): 80 W

With a high power dissipation capacity of 80W, this transistor can handle large amounts of power without overheating, ideal for high-power applications.

Maximum Collector Current (IC): 8 A

The high collector current rating of 8A allows for handling of high current loads, making it suitable for applications requiring high current capabilities.

Technical Specifications

Power Bipolar Junction Transistors (BJT) TIP101G attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

8 A

Maximum Collector-Emitter Voltage:

80 V

Minimum DC Current Gain (hFE):

200

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

TIP101G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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