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TCM-1C127U-IM

Onsemi

TCM-1C127U-IM by Onsemi

Onsemi's TCM-1C127U-IM is a plastic RF antenna support circuit with 9 terminals, operating from -30 °C to 85°C. It has a max frequency of 2700 MHz and is designed for surface mount applications in RF/Microwave systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 990 parts In-Stock

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Digiode

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SupplyDigital Components

Austria . 8,057 parts In-Stock

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Problanco Electronics

Mexico . 7,605 parts In-Stock

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Kulean Microsystems

USA . 3,361 parts In-Stock

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TANS Electronics

Latvia . 2,402 parts In-Stock

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Corphita

USA . 1,722 parts In-Stock

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Corohmni

South Africa . 352 parts In-Stock

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UHIMA Technologies

Türkiye . 14 parts In-Stock

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Overview

Enhance your RF/Microwave antenna systems with the TCM-1C127U-IM by Onsemi. Crafted from high-quality plastic, this antenna support circuit offers reliable performance from -30 °C to 85°C, making it ideal for a wide range of applications. With its surface mount design and maximum operating frequency of 2700 MHz, this component provides seamless integration and optimal signal reception. Trust Onsemi's expertise in RF technology to deliver superior quality and functionality, ensuring that your projects reach new heights of efficiency and performance. Elevate your antenna systems with the TCM-1C127U-IM and experience the difference that top-tier components can make.

Feature Benefit Bullets

Package Body Material: PLASTIC

Plastic material makes the antenna lightweight and durable, ideal for applications where weight is a concern.

Construction: COMPONENT

Component construction allows for easy integration into existing circuit designs, making it convenient for engineers to incorporate this antenna into their systems.

No. of Terminals: 9

Having 9 terminals provides flexibility in wiring configurations and allows for more complex RF connections to be made with this antenna.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this antenna can withstand harsh environmental conditions, making it suitable for a wide range of applications.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature of -30 °C ensures that this antenna can operate in cold environments without any performance degradation.

RF or Microwave Device Type: ANTENNA SUPPORT CIRCUIT

Being an antenna support circuit, this product helps in enhancing the overall performance and reliability of the antenna system, making it a valuable addition to RF/microwave setups.

Mounting Feature: SURFACE MOUNT

A surface mount feature makes installation quick and easy, allowing for seamless integration into circuit boards without the need for additional mounting hardware.

Maximum Operating Frequency: 2700 MHz

The high maximum operating frequency of 2700 MHz ensures that this antenna can handle high-frequency signals, making it suitable for a wide range of RF/microwave applications.

Technical Specifications

RF/Microwave Antennas TCM-1C127U-IM attributes and parameters. Explore more RF/Microwave Antennas devices from Onsemi

Specs

Construction:

COMPONENT

Mounting Feature:

No. of Elements:

1

No. of Terminals:

9

Maximum Operating Frequency:

2700 MHz

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

Package Equivalence Code:

BGA9,2X5,16

RF or Microwave Device Type:

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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