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SZNZ8F10VMX2WT5G

Onsemi

SZNZ8F10VMX2WT5G by Onsemi

SZNZ8F10VMX2WT5G by Onsemi is a Zener diode with a 10V nominal reference voltage and 5% max voltage tolerance. It operates in temperatures ranging from -65 to 150 °C and has a max power dissipation of 0.25W. Ideal for applications requiring precise voltage regulation in automotive electronics, it features a small outline package with dual terminals for surface mount assembly.

Median Price

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Lifecycle Status

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2

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1k+

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Vyrian

USA . 5,798 parts In-Stock

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AZTECH Wire

Italy . 312 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 11,446 parts In-Stock

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SupplyDigital Components

Austria . 5,837 parts In-Stock

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Kulean Microsystems

USA . 3,273 parts In-Stock

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Corphita

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TANS Electronics

Latvia . 2,260 parts In-Stock

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UHIMA Technologies

Türkiye . 739 parts In-Stock

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Problanco Electronics

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South Africa . 230 parts In-Stock

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Overview

Discover the unmatched quality and performance of the SZNZ8F10VMX2WT5G by Onsemi, a top-of-the-line Zener Diode that exceeds all expectations. Manufactured by Onsemi, a trusted name in the industry, this diode offers unparalleled reliability and precision. Ideal for a wide range of applications, this Zener Diode provides customers with superior voltage regulation and protection. With its advanced technology and durable design, the SZNZ8F10VMX2WT5G ensures long-lasting functionality and peace of mind. Upgrade your electronic projects with this high-quality Zener Diode today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the diode, ensuring long-lasting performance in various environments.

Working Test Current: 5 mA

Suitable for low power applications where a consistent current is required.

Maximum Reverse Current: 0.1 uA

Low reverse current allows for efficient operation and prevents leakage.

Maximum Reverse Test Voltage: 7 V

Ensures reliable performance under reverse voltage conditions up to 7 volts.

Maximum Operating Temperature: 150 °C

Can withstand high temperatures, making it suitable for industrial and automotive applications.

Maximum Power Dissipation: 0.25 W

Capable of handling power dissipation up to 0.25 watts, making it suitable for various power requirements.

Technical Specifications

Zener Diodes SZNZ8F10VMX2WT5G attributes and parameters. Explore more Zener Diodes devices from Onsemi

Specs

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

Maximum Dynamic Impedance:

30 ohm

Maximum Forward Voltage (VF):

.9 V

JESD-30 Code:

R-PDSO-N2

JESD-609 Code:

e4

Maximum Knee Impedance:

60 ohm

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-65 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity:

UNIDIRECTIONAL

Maximum Power Dissipation:

.25 W

Reference Standard:

AEC-Q101

Nominal Reference Voltage:

10 V

Maximum Reverse Current:

.1 uA

Reverse Test Voltage:

7 V

Surface Mount:

YES

Technology:

ZENER

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

5 %

Working Test Current:

5 mA

Trade Compliance

SZNZ8F10VMX2WT5G Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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