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SZNCP3712ASNT1G

Onsemi

SZNCP3712ASNT1G by Onsemi

SZNCP3712ASNT1G by Onsemi is a Peripheral Driver with 6 terminals, operating at -40 to 85°C. It offers built-in protections for overvoltage and transient conditions, with a max output current of 0.3A at 12.5V supply voltage. Ideal for industrial applications requiring buffer or inverter-based peripheral drivers in compact spaces.

Median Price

$0.149

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 45,000 parts In-Stock

1+ parts

$0.149

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45,000

$0.149

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Verical

USA . 45,000 parts In-Stock

1+ parts

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$0.149

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45,000

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$0.149

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Chip1Stop

Japan . 45,000 parts In-Stock

1+ parts

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45,000

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Rochester

USA . 24,000 parts In-Stock

1+ parts

-

100+ parts

$0.246

1k+ parts

$0.205

10k+ parts

$0.182

24,000

-

$0.246

$0.205

$0.182

Flip Electronics (Authorized)

USA . 21,000 parts In-Stock

1+ parts

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21,000

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DigiKey

USA . 6,000 parts In-Stock

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$0.130

6,000

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$0.130

Mouser Electronics

USA . 88 parts In-Stock

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$0.198

88

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$0.198

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 335 parts In-Stock

1+ parts

$0.140

100+ parts

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335

$0.140

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Vyrian

USA . 2,492 parts In-Stock

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$0.147

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Chip Stock

USA . 65,000 parts In-Stock

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Flip Electronics

USA . 6,000 parts In-Stock

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6,000

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Distributors (Availability)

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Corphita

USA . 127 parts In-Stock

1+ parts

$0.132

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127

$0.132

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Corohmni

South Africa . 459 parts In-Stock

1+ parts

$0.147

100+ parts

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459

$0.147

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Component Stockers USA

USA . 189,543 parts In-Stock

1+ parts

$0.170

100+ parts

$0.170

1k+ parts

$0.170

10k+ parts

$0.160

189,543

$0.170

$0.170

$0.170

$0.160

Kepictronics

USA . 108,000 parts In-Stock

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Continental Prestige Electronics

USA . 83,000 parts In-Stock

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$0.153

10k+ parts

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83,000

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$0.153

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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Kulean Microsystems

USA . 6,989 parts In-Stock

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6,989

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SupplyDigital Components

Austria . 6,640 parts In-Stock

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6,640

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Problanco Electronics

Mexico . 771 parts In-Stock

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771

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UHIMA Technologies

Türkiye . 738 parts In-Stock

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738

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TANS Electronics

Latvia . 17 parts In-Stock

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Overview

Enhance your electronic designs with the SZNCP3712ASNT1G by Onsemi, a top-quality peripheral driver that offers reliable performance and built-in protections against overvoltage and transient events. Manufactured by Onsemi, a leading name in the industry, this product is designed for industrial-grade applications and features a compact package style for easy integration. With a nominal supply voltage of 12.5V and an output current of 0.3A, this peripheral driver delivers exceptional value and efficiency to customers looking to optimize their systems. Upgrade your projects with the SZNCP3712ASNT1G and experience superior performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the peripheral driver.

Built-in Protections: OVER VOLTAGE; TRANSIENT

Ensures the safety and longevity of connected devices by protecting against potentially damaging voltage spikes.

Power Supplies (V): 12.5

Provides a stable and reliable power source for connected peripherals.

Maximum Operating Temperature: 85 °C

Allows for operation in a wide range of environments, making the peripheral driver versatile and adaptable.

Technology: BIPOLAR

Offers reliable performance and compatibility with a variety of devices.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Allows for seamless integration with different types of peripherals, enhancing the versatility of the product.

Technical Specifications

Peripheral Drivers SZNCP3712ASNT1G attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

OVER VOLTAGE; TRANSIENT

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE

Maximum Output Current:

.3 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

12.5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Sub-Category:

Peripheral Drivers

Nominal Supply Voltage:

12.5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.5 mm

Trade Compliance

SZNCP3712ASNT1G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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