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SZNCP3712ASNT3G

Onsemi

SZNCP3712ASNT3G by Onsemi

SZNCP3712ASNT3G by Onsemi is a Peripheral Driver with 12.5V power supply, 0.3A max output current, and AEC-Q100 screening level. It is used in industrial applications for interfacing with buffer or inverter based systems due to its bipolar technology and dual terminal position.

Median Price

$0.253

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 10,000 parts In-Stock

1+ parts

$0.182

100+ parts

-

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10,000

$0.182

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Rochester

USA . 68,475 parts In-Stock

1+ parts

-

100+ parts

$0.274

1k+ parts

$0.227

10k+ parts

$0.203

68,475

-

$0.274

$0.227

$0.203

Verical

USA . 68,475 parts In-Stock

1+ parts

-

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$0.253

68,475

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$0.253

Chip1Stop

Japan . 10,000 parts In-Stock

1+ parts

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10,000

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Distributors (In-Stock)

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Digiode

USA . 854 parts In-Stock

1+ parts

$0.173

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854

$0.173

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Vyrian

USA . 5,502 parts In-Stock

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5,502

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Distributors (Availability)

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Ampacity Inc.

Singapore . 42,245 parts In-Stock

1+ parts

$0.155

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42,245

$0.155

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Corphita

USA . 2,289 parts In-Stock

1+ parts

$0.164

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2,289

$0.164

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Corohmni

South Africa . 253 parts In-Stock

1+ parts

$0.182

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253

$0.182

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AZTECH Wire

Italy . 186 parts In-Stock

1+ parts

$10.390

100+ parts

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186

$10.390

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Infinite Electronics LLP (Excess)

. 10,003 parts In-Stock

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10,003

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Continental Prestige Electronics

USA . 9,863 parts In-Stock

1+ parts

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$0.177

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9,863

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$0.177

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SupplyDigital Components

Austria . 8,008 parts In-Stock

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8,008

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Kulean Microsystems

USA . 4,026 parts In-Stock

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4,026

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Problanco Electronics

Mexico . 3,989 parts In-Stock

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3,989

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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TANS Electronics

Latvia . 1,504 parts In-Stock

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UHIMA Technologies

Türkiye . 778 parts In-Stock

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778

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Overview

Enhance your electronic designs with the high-quality SZNCP3712ASNT3G peripheral driver by Onsemi. Designed with precision and reliability in mind, this product offers superior performance for a wide range of applications. With its small outline and thin profile package style, this peripheral driver is perfect for industrial settings where temperature fluctuations are common. Trust in Onsemi's reputation for excellence and choose the SZNCP3712ASNT3G for your next project. Unlock the full potential of your electronics with this innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the peripheral driver, making it suitable for various applications.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving space and facilitating automated assembly processes.

Screening Level: AEC-Q100

Ensures high reliability and quality standards, making it ideal for automotive applications where robustness is critical.

Power Supplies (V): 12.5

Provides a stable power source for the peripheral driver to operate efficiently within its specified voltage range.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, ensuring reliable performance in challenging environments.

Maximum Output Current: 0.3 A

Capable of delivering a sufficient current to drive peripheral components effectively without overheating.

Technology: BIPOLAR

Utilizes bipolar technology for enhanced performance and reliability in driving peripheral devices.

Technical Specifications

Peripheral Drivers SZNCP3712ASNT3G attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.3 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

12.5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Sub-Category:

Peripheral Drivers

Nominal Supply Voltage:

12.5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

SZNCP3712ASNT3G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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