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SBS817-TL-E

Onsemi

SBS817-TL-E by Onsemi

SBS817-TL-E by Onsemi is a Schottky rectifier diode with 2 elements, offering a max output current of 2A and forward voltage of 0.46V. With a reverse test voltage of 7.5V and fast recovery time of 0.01us, it is ideal for applications requiring high efficiency and low power loss in compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 6,490 parts In-Stock

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Digiode

USA . 1,547 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 200 parts In-Stock

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AZTECH Wire

Italy . 218 parts In-Stock

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$19.630

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Component Stockers USA

USA . 293 parts In-Stock

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$99.990

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Kulean Microsystems

USA . 3,765 parts In-Stock

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Corphita

USA . 1,791 parts In-Stock

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TANS Electronics

Latvia . 1,242 parts In-Stock

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SupplyDigital Components

Austria . 693 parts In-Stock

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Problanco Electronics

Mexico . 626 parts In-Stock

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UHIMA Technologies

Türkiye . 509 parts In-Stock

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

UK . 200 parts In-Stock

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Glotronic Ltd.

UK . 160 parts In-Stock

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Corohmni

South Africa . 115 parts In-Stock

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Overview

Experience the next level of performance with the SBS817-TL-E by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality diodes and rectifiers that are designed for a wide range of applications. With its advanced technology and reliable construction, this product offers superior efficiency and durability, making it the ideal choice for your electronic projects. Trust Onsemi to provide you with the value, benefits, and advantages you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ensuring better protection for the diodes.

Maximum Reverse Recovery Time: 0.01 us

The fast reverse recovery time of 0.01 microseconds ensures efficient performance and minimal power loss in high-speed applications.

Maximum Forward Voltage (VF): 0.46 V

With a low forward voltage of 0.46 volts, this diode offers efficient conduction and helps in reducing power dissipation.

Maximum Output Current: 2 A

The high maximum output current of 2 amperes allows this diode to handle high power applications with ease.

Technology: SCHOTTKY

The Schottky technology used in this diode ensures low forward voltage drop and fast switching speed, making it ideal for high-frequency applications.

Technical Specifications

Diodes & Rectifiers SBS817-TL-E attributes and parameters. Explore more Diodes & Rectifiers devices from Onsemi

Specs

Application:

GENERAL PURPOSE

Config:

SEPARATE, 2 ELEMENTS

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

.46 V

JESD-30 Code:

R-PDSO-F8

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Forward Current:

20 A

No. of Elements:

2

No. of Phases:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Current:

2 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Repetitive Peak Reverse Voltage:

15 V

Maximum Reverse Current:

300 uA

Maximum Reverse Recovery Time:

.01 us

Reverse Test Voltage:

7.5 V

Sub-Category:

Other Diodes

Surface Mount:

YES

Technology:

SCHOTTKY

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Position:

Trade Compliance

SBS817-TL-E Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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