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RFD14N05L

Onsemi

RFD14N05L by Onsemi

RFD14N05L by Onsemi is a N-CHANNEL Power FET with 50V DS Breakdown Voltage and 14A Drain Current. It is used for SWITCHING applications, featuring a built-in diode and 0.1 ohm On Resistance. The transistor operates in ENHANCEMENT MODE with a max power dissipation of 48W at 175°C temperature.

Median Price

$0.797

Lifecycle Status

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26

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1k+

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Arrow

USA . 1,180 parts In-Stock

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$0.797

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$0.623

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$0.599

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$0.797

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Flip Electronics (Authorized)

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Digiode

USA . 2,698 parts In-Stock

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$0.757

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American Microsemiconductor Inc.

USA . 525 parts In-Stock

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Nova Conductors

Japan . 1,000 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 11,028 parts In-Stock

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ComSIT Distribution GmbH

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Odintec Ltd.

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Florida Circuit

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North Shore Components

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Inland Empire Components Inc.

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J & M Industries LLC

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PC Components Company LLC

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Continental Prestige Electronics

USA . 1,634 parts In-Stock

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$0.347

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Argo Parts USA

USA . 84 parts In-Stock

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Semicontronic

India . 1,665 parts In-Stock

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$0.660

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Corphita

USA . 414 parts In-Stock

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Component Stockers USA

USA . 1,610 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,091 parts In-Stock

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Corohmni

South Africa . 601 parts In-Stock

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Metaverse IC Inc.

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UHIMA Technologies

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iodParts Technologies Inc.

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Overview

Enhance your power switching applications with the RFD14N05L by Onsemi. Manufactured with the highest quality standards, this N-CHANNEL Power FET offers unparalleled performance and reliability. With a built-in diode and a maximum drain current of 14A, this transistor is perfect for a wide range of switching tasks. Say goodbye to overheating issues, as the RFD14N05L can handle a maximum power dissipation of 48W. Trust Onsemi to deliver top-notch products that exceed your expectations. Experience the value and benefits of the RFD14N05L today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components of the FET, ensuring reliability and longevity.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics and lower on-resistance compared to P-channel FETs, making them ideal for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse voltage spikes, increasing the overall efficiency and reliability of the system.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low on-resistance, making it suitable for high-frequency power conversion.

Minimum DS Breakdown Voltage: 50 V

With a minimum breakdown voltage of 50 V, this FET can handle higher voltages without breakdown, making it suitable for a wide range of power applications.

Maximum Power Dissipation (Abs): 48 W

The high power dissipation rating allows the FET to handle large amounts of power without overheating, ensuring reliable operation under high load conditions.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175°C, this FET can withstand elevated temperatures without performance degradation, making it suitable for harsh environments.

Technical Specifications

Power Field Effect Transistors (FET) RFD14N05L attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

50 V

Maximum Drain Current (Abs) (ID):

14 A

Maximum Drain Current (ID):

14 A

Maximum Drain-Source On Resistance:

.1 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-251AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

RFD14N05L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-01-422-0229, 5961014220229

NIIN

014220229

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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