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P3I623S00BG-08TR

Onsemi

P3I623S00BG-08TR by Onsemi

P3I623S00BG-08TR Clock Driver by Onsemi operates at 3.3V, with 8 terminals in a small outline package. It has a max frequency of 50MHz and industrial temperature grade, suitable for clock distribution in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,548 parts In-Stock

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5,548

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Digiode

USA . 2,469 parts In-Stock

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2,469

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J2 Sourcing AB

Sweden . 1,395 parts In-Stock

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1,395

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Distributors (Availability)

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AZTECH Wire

Italy . 1,136 parts In-Stock

1+ parts

$8.650

100+ parts

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1,136

$8.650

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$32.483

100+ parts

$29.560

1k+ parts

$26.636

10k+ parts

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2,000

$32.483

$29.560

$26.636

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QUARKTWIN TECHNOLOGY LTD

USA . 15,007 parts In-Stock

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15,007

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TANS Electronics

Latvia . 8,118 parts In-Stock

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8,118

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Kulean Microsystems

USA . 3,254 parts In-Stock

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3,254

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UHIMA Technologies

Türkiye . 930 parts In-Stock

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930

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Corphita

USA . 928 parts In-Stock

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928

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Problanco Electronics

Mexico . 897 parts In-Stock

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Vigor

Singapore . 876 parts In-Stock

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Corohmni

South Africa . 418 parts In-Stock

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418

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Microchip USA

USA . 142 parts In-Stock

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142

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SupplyDigital Components

Austria . 95 parts In-Stock

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95

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Overview

Experience the next level of precision and reliability with the P3I623S00BG-08TR by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch Clock Drivers & Buffers that are designed to meet the highest standards of quality and performance. Whether you're working on telecommunications, networking, or industrial applications, this product is guaranteed to provide unparalleled value and benefits. Trust Onsemi to provide you with the innovative solutions you need for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the clock driver/buffer.

Surface Mount: YES

Allows for easy and convenient installation on a circuit board, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 3.3V

Optimal voltage level for reliable operation and performance of the clock driver/buffer.

Maximum Operating Temperature: 85 °C

Suitable for use in industrial environments where higher temperatures may be present.

Minimum Operating Temperature: -40 °C

Can function effectively in low temperature conditions without any issues.

Terminal Finish: MATTE TIN

Provides a strong and reliable connection between the clock driver/buffer and other components.

Width: 4.4 mm

Compact size for efficient use of space on a circuit board.

Maximum Same Edge Skew (tskwd): 0.25 ns

Ensures precise and accurate timing signals for synchronized operations.

Minimum fmax: 50 MHz

Supports high-frequency operations for applications requiring fast data processing.

Maximum Supply Voltage (Vsup): 3.6V

Provides a safety margin for voltage fluctuations to prevent damage to the clock driver/buffer.

Technical Specifications

Clock Drivers & Buffers P3I623S00BG-08TR attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

S

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.25 ns

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Minimum fmax:

50 MHz

Trade Compliance

P3I623S00BG-08TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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