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NVF3055L108T3G

Onsemi

NVF3055L108T3G by Onsemi

NVF3055L108T3G by Onsemi is a N-CHANNEL FET with 3A max drain current and 2.1W power dissipation. Ideal for power applications, it operates at up to 175°C and features surface mount configuration for easy installation in various electronic devices.

Median Price

$0.384

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 187,860 parts In-Stock

1+ parts

-

100+ parts

$0.282

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$0.234

10k+ parts

$0.209

187,860

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$0.282

$0.234

$0.209

Verical

USA . 176,000 parts In-Stock

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$0.487

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$0.434

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$0.487

$0.434

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Chip Stock

USA . 198,239 parts In-Stock

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Flip Electronics

USA . 36,000 parts In-Stock

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36,000

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Vyrian

USA . 11,479 parts In-Stock

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11,479

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Semtec, LLC

USA . 2,542 parts In-Stock

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Digiode

USA . 1,291 parts In-Stock

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Nova Conductors

Japan . 79 parts In-Stock

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Distributors (Availability)

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Advanced Electronics

New Zealand . 108 parts In-Stock

1+ parts

$0.481

100+ parts

$0.442

1k+ parts

$0.415

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-

108

$0.481

$0.442

$0.415

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Aztec Data Supply Inc.

USA . 1,637 parts In-Stock

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$1.270

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1,637

$1.270

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AZTECH Wire

Italy . 436 parts In-Stock

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$5.886

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Semicontronic

India . 793 parts In-Stock

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$11.050

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$10.774

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$10.718

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793

$11.050

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$10.718

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Ampacity Inc.

Singapore . 944 parts In-Stock

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$61.050

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RC Electronics

USA . 35,100 parts In-Stock

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iodParts Technologies Inc.

India . 13,440 parts In-Stock

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Perfect Parts

USA . 8,960 parts In-Stock

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Continental Prestige Electronics

USA . 5,860 parts In-Stock

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TANS Electronics

Latvia . 5,378 parts In-Stock

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SupplyDigital Components

Austria . 4,076 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Problanco Electronics

Mexico . 2,566 parts In-Stock

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Corphita

USA . 1,888 parts In-Stock

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Kulean Microsystems

USA . 881 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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Argo Parts USA

USA . 688 parts In-Stock

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Corohmni

South Africa . 438 parts In-Stock

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UHIMA Technologies

Türkiye . 254 parts In-Stock

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Overview

Enhance your power management solutions with the NVF3055L108T3G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality products that guarantee reliability and efficiency. This N-CHANNEL Power FET is designed for a variety of applications, ensuring seamless performance in any project. With a maximum drain current of 3A and a power dissipation of 2.1W, this transistor offers exceptional value and benefits to customers looking for high-quality components. Trust Onsemi to provide innovative solutions that meet your power needs effortlessly.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs typically have lower on-state resistance and higher current-carrying capability compared to P-CHANNEL FETs.

Configuration: SINGLE

SINGLE configuration simplifies the circuit design and makes it easier to control the FET.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and enabling automated assembly processes.

Maximum Drain Current (Abs) (ID): 3 A

High maximum drain current allows for handling higher power loads and ensures reliability under heavy usage.

Maximum Power Dissipation (Abs): 2.1 W

With a high maximum power dissipation, the FET can operate efficiently under varying load conditions without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductor FETs offer low gate drive requirements, high input impedance, and good thermal stability.

Maximum Operating Temperature: 175 °C

High maximum operating temperature allows for use in a wide range of applications without the risk of overheating or degradation.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability, creating a reliable electrical connection and ensuring long-term performance.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature ensures that the FET components are not exposed to excessive heat, minimizing the risk of damage.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for proper soldering and ensures a secure connection between the FET and the PCB.

Technical Specifications

Power Field Effect Transistors (FET) NVF3055L108T3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

3 A

Maximum Drain Current (ID):

3 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NVF3055L108T3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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