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NUF8610MNTXG

Onsemi

NUF8610MNTXG by Onsemi

NUF8610MNTXG by Onsemi is a Data Line Filter with 8 functions and 16 terminals. It offers 15 dB attenuation at 800 MHz, rated for 5V, and operates b/w -40 to 85 °C. Ideal for applications requiring data line filtering in compact spaces.

Median Price

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Lifecycle Status

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3

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1k+

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AZTECH Wire

Italy . 769 parts In-Stock

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TANS Electronics

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Problanco Electronics

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SupplyDigital Components

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Overview

Discover the superior quality and reliability of Onsemi's NUF8610MNTXG data line filter, designed to meet the highest industry standards. With 8 functions and a maximum attenuation frequency of 800 MHz, this filter offers unparalleled performance for your electronic devices. Approved by IEC, this filter provides smooth data transmission while ensuring optimal signal integrity. Experience the benefits of reduced interference and improved signal quality with the NUF8610MNTXG, making it the perfect choice for a wide range of applications. Unlock the potential of your electronics with this cutting-edge filter from Onsemi.

Feature Benefit Bullets

Approvals (V) IEC: 5

Having IEC approvals ensures that the product meets international standards for safety and quality.

Rated Voltage: 5 V

Suitable for use with electronic devices requiring a 5V power supply.

Attenuation At Maximum Frequency: 15 dB

Provides effective filtering and reduces interference at high frequencies.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, making it durable and reliable.

Mounting Type: SURFACE MOUNT

Easy to install on circuit boards, allowing for efficient integration into electronic devices.

Technical Specifications

Data Line Filters NUF8610MNTXG attributes and parameters. Explore more Data Line Filters devices from Onsemi

Specs

Additional Features:

CUT-OFF FREQUENCY AT 260 MHZ; PI TYPE CIRCUIT

Approvals (V):

IEC

Maximum Attenuation Frequency:

800 MHz

Attenuation At Maximum Frequency:

15 dB

Capacitance:

17 uF

Maximum DC Resistance:

Filter Type:

Height:

1 mm

JESD-609 Code:

e3

Length:

4 mm

Mounting Type:

SURFACE MOUNT

No. of Functions:

8

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Impedance (ohm):

50 OHM

Package Material:

PLASTIC

Packing Method:

TAPE AND REEL

Dimensions:

L4.0XB1.6XH1.0 (mm)/L0.157XB0.063XH0.039 (inch)

Rated Voltage:

5 V

Sub-Category:

Data Line Filters

Terminal Finish:

Tin (Sn)

Width (mm):

1.6

Trade Compliance

NUF8610MNTXG Filters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8504.50.80.00

SB

8504.50.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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