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NTF6P02T3

Onsemi

NTF6P02T3 by Onsemi

NTF6P02T3 by Onsemi is a P-CHANNEL FET with 20V DS Breakdown Voltage, 35A IDM, and 0.05 ohm RDS(on). Ideal for SWITCHING applications in ENHANCEMENT MODE operation. Features include SINGLE configuration with BUILT-IN DIODE, GULL WING terminals, and 150 °C max operating temp.

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LWI Electronics Inc

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Kepictronics

USA . 20,000 parts In-Stock

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TANS Electronics

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SupplyDigital Components

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Kulean Microsystems

USA . 5,691 parts In-Stock

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Problanco Electronics

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Overview

Discover the power and efficiency of the NTF6P02T3 by Onsemi, a high-quality Power Field Effect Transistor designed for switching applications. With a single configuration and built-in diode, this P-CHANNEL transistor offers superior performance and reliability. Ideal for a variety of electronic devices, this transistor provides customers with increased efficiency, faster operation, and enhanced functionality. Trust in Onsemi's reputation for excellence and innovation, and experience the value and benefits that the NTF6P02T3 brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the FET, making it suitable for various operating conditions.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low on-resistance and high input impedance, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and provides reverse polarity protection, enhancing the reliability of the FET.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low power dissipation for efficient operation.

Surface Mount: YES

Surface mount capability allows for easy PCB integration and space-saving design.

Minimum DS Breakdown Voltage: 20 V

The 20V breakdown voltage ensures reliable performance in various voltage applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and space-efficient placement on PCBs.

Terminal Form: GULL WING

The gull wing terminal form provides secure soldering connections for reliable electrical conductivity.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer easy control and lower gate voltage requirements, making them suitable for high-speed applications.

Maximum Pulsed Drain Current (IDM): 35 A

The high pulsed drain current rating allows for reliable operation under high current load conditions.

Avalanche Energy Rating (EAS): 150 mJ

The 150mJ avalanche energy rating ensures the FET can withstand transient voltage spikes without damage.

Maximum Drain Current (Abs) (ID): 10 A

The 10A maximum drain current rating provides ample current-handling capacity for various applications.

No. of Terminals: 4

The 4-terminal configuration allows for easy connectivity and versatile use in circuit designs.

Maximum Power Dissipation (Abs): 8.3 W

The 8.3W maximum power dissipation rating ensures the FET can handle high power levels without overheating.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and allows for compact designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high switching speeds and low power consumption, ideal for efficient operation.

Maximum Operating Temperature: 150 °C

The 150 °C maximum operating temperature allows the FET to operate reliably in high-temperature environments.

Transistor Element Material: SILICON

Silicon material provides high performance and reliability for the FET, ensuring long-term operation.

Terminal Finish: TIN LEAD

The tin lead finish provides corrosion resistance and reliable soldering connections for consistent electrical performance.

Maximum Drain-Source On Resistance: 0.05 ohm

The low on-resistance of 0.05 ohm reduces power loss and improves efficiency in switching applications.

Terminal Position: DUAL

The dual terminal position allows for flexibility in circuit layout and connection options.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates the FET's moderate sensitivity to moisture, suitable for a wide range of operating environments.

Case Connection: DRAIN

The drain case connection offers efficient heat dissipation and electrical connection for reliable performance.

Peak Reflow Temperature °C: 235

The high peak reflow temperature of 235 °C ensures secure soldering connections during assembly processes.

Technical Specifications

Power Field Effect Transistors (FET) NTF6P02T3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

150 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

10 A

Maximum Drain Current (ID):

10 A

Maximum Drain-Source On Resistance:

.05 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-261AA

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

35 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTF6P02T3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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