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NSI45090DDT4G

Onsemi

NSI45090DDT4G by Onsemi

NSI45090DDT4G by Onsemi is a small outline LED display driver with 3 terminals, GULL WING form, and 2.29mm pitch. It has a peak reflow temp of 260 °C and is ideal for graphics display applications due to its compact size (6.095mm x 6.54mm) and surface mount capability.

Median Price

$0.260

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 145,325 parts In-Stock

1+ parts

$0.260

100+ parts

$0.250

1k+ parts

$0.250

10k+ parts

-

145,325

$0.260

$0.250

$0.250

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 795 parts In-Stock

1+ parts

$0.247

100+ parts

-

1k+ parts

-

10k+ parts

-

795

$0.247

-

-

-

Vyrian

USA . 3,404 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,404

-

-

-

-

ComSIT Distribution GmbH

Germany . 79 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

79

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 453 parts In-Stock

1+ parts

$0.234

100+ parts

-

1k+ parts

-

10k+ parts

-

453

$0.234

-

-

-

Corohmni

South Africa . 155 parts In-Stock

1+ parts

$0.260

100+ parts

-

1k+ parts

-

10k+ parts

-

155

$0.260

-

-

-

Vigor

Singapore . 638 parts In-Stock

1+ parts

$0.280

100+ parts

-

1k+ parts

-

10k+ parts

-

638

$0.280

-

-

-

AZTECH Wire

Italy . 750 parts In-Stock

1+ parts

$11.480

100+ parts

-

1k+ parts

-

10k+ parts

-

750

$11.480

-

-

-

TANS Electronics

Latvia . 7,307 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,307

-

-

-

-

Problanco Electronics

Mexico . 4,756 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,756

-

-

-

-

SupplyDigital Components

Austria . 4,114 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,114

-

-

-

-

Authorized Procurement Solutions

USA . 2,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,700

-

-

-

-

Kulean Microsystems

USA . 1,760 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,760

-

-

-

-

Microchip USA

USA . 352 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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352

-

-

-

-

Kepictronics

USA . 135 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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135

-

-

-

-

UHIMA Technologies

Türkiye . 126 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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126

-

-

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Assy Fe

Spain . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5

-

-

-

-

Overview

Enhance your display projects with the NSI45090DDT4G by Onsemi, a top-quality graphics display driver that offers unmatched performance and reliability. With Onsemi's reputation for excellence in manufacturing, you can trust that this product meets the highest standards. Ideal for a variety of applications, this surface-mount driver is compact and efficient, providing value and convenience to customers looking to elevate their visual displays. Upgrade your projects today with the NSI45090DDT4G and experience the benefits of superior technology at your fingertips.

Feature Benefit Bullets

Surface Mount: YES

Surface mount allows for easy installation and reduces the overall size of the component, making it ideal for compact designs.

Package Shape: RECTANGULAR

Rectangular shape provides a standardized form factor that is easy to handle and integrate into different systems.

No. of Terminals: 3

Having a small number of terminals simplifies the wiring and connectivity process, leading to easier assembly and maintenance.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and contributes to a more streamlined design layout.

Terminal Finish: TIN

Tin terminal finish offers good solderability and electrical conductivity, ensuring reliable performance and longevity.

Terminal Position: SINGLE

Single terminal position reduces confusion during installation and minimizes the risk of wiring errors.

Maximum Seated Height: 2.38 mm

Low seated height allows for a thinner profile, enabling the product to be used in slim devices where space is limited.

Width: 6.095 mm

Compact width dimension facilitates close placement of components on the PCB, optimizing board space efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

Efficient reflow process with a short exposure time to high temperatures ensures proper solder joint formation without damaging sensitive components.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance allows for reliable soldering in industrial processes with stringent temperature requirements.

Length: 6.54 mm

Optimal length dimension for easier handling and installation, fitting well within standard PCB layouts.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability and ease of soldering, enhancing overall product durability and manufacturability.

Terminal Pitch: 2.29 mm

Fine terminal pitch spacing allows for high-density mounting and precise alignment on the PCB, enabling compact design configurations.

Interface IC Type: LED DISPLAY DRIVER

Being an LED display driver interface IC type ensures compatibility with various display technologies, making it suitable for a wide range of applications.

Technical Specifications

Graphics Display Drivers NSI45090DDT4G attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-XSSO-G3

JESD-609 Code:

e3

Length:

6.54 mm

Moisture Sensitivity Level (MSL):

1

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

1

No. of Terminals:

3

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.38 mm

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

2.29 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.095 mm

Trade Compliance

NSI45090DDT4G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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