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NLX2G66AMUTCG

Onsemi

NLX2G66AMUTCG by Onsemi

NLX2G66AMUTCG by Onsemi is a CMOS differential multiplexer with 2 functions, 8 terminals, and a max on-state resistance of 30 ohm. It operates b/w -55 to 125 °C and is suitable for military-grade applications requiring separate output voltages in a small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

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Digiode

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SupplyDigital Components

Austria . 7,492 parts In-Stock

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Problanco Electronics

Mexico . 3,842 parts In-Stock

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TANS Electronics

Latvia . 1,469 parts In-Stock

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Kulean Microsystems

USA . 1,349 parts In-Stock

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Corphita

USA . 778 parts In-Stock

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UHIMA Technologies

Türkiye . 428 parts In-Stock

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Corohmni

South Africa . 405 parts In-Stock

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Overview

Unleash the power of innovation with the NLX2G66AMUTCG by Onsemi, a cutting-edge multiplexer that sets the standard for quality and performance. Designed to excel in a wide range of applications, this versatile device offers unparalleled value and benefits to customers. With Onsemi's reputation for excellence and precision engineering, you can trust that the NLX2G66AMUTCG will deliver exceptional results every time. Upgrade your projects with this advanced solution and experience the advantages of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and reliability in various operating conditions.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

No. of Functions: 2

Provides versatility and flexibility in signal routing and processing.

Package Shape: RECTANGULAR

Compact rectangular shape saves space on the PCB while ensuring efficient signal routing.

Power Supplies (V): 1.8/5

Supports a wide range of voltage inputs, making it compatible with various power systems.

No. of Terminals: 8

Offers sufficient connection points for input and output signals, enhancing connectivity options.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for high-density mounting on the PCB.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures, suitable for demanding industrial and military applications.

Minimum Operating Temperature: -55 °C

Operational in extremely cold environments, ensuring reliability in harsh conditions.

Terminal Position: DUAL

Dual terminal position provides redundancy and improves signal integrity.

Output (V): SEPARATE OUTPUT

Separate output design prevents signal interference and ensures accurate data transmission.

Other IC type: DIFFERENTIAL MULTIPLEXER

Differential multiplexer technology offers superior performance in signal processing and noise reduction.

Maximum On-state Resistance (Ron): 30 ohm

Low on-state resistance minimizes signal loss and distortion, enabling efficient signal transmission.

Temperature Grade: MILITARY

Built to withstand rugged military environments, ensuring durability and reliability in harsh conditions.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and fast switching speeds.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and eliminates risks associated with lead soldering.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for precise connections and high-density integration on the PCB.

Technical Specifications

Multiplexers & Switches NLX2G66AMUTCG attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-N8

Normal Position (V):

NO

No. of Functions:

2

No. of Terminals:

8

Maximum On-state Resistance (Ron):

30 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC8,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trade Compliance

NLX2G66AMUTCG Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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