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NID6002NT4G

Onsemi

NID6002NT4G by Onsemi

BUFFER OR INVERTER BASED PERIPHERAL DRIVER; JESD-609 Code: e3; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260;

Median Price

$0.615

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$0.190

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450

$0.190

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Freelance Electronics

USA . 1,290 parts In-Stock

1+ parts

$1.040

100+ parts

$1.092

1k+ parts

$1.030

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1,290

$1.040

$1.092

$1.030

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ComSIT Distribution GmbH

Germany . 12,370 parts In-Stock

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12,370

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ComSIT USA

USA . 12,370 parts In-Stock

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Chip Stock

USA . 9,101 parts In-Stock

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Vyrian

USA . 4,664 parts In-Stock

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4,664

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Digiode

USA . 1,173 parts In-Stock

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NAC Semi

USA . 20 parts In-Stock

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Distributors (Availability)

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$0.186

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$0.179

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100

$0.186

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$0.179

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Corohmni

South Africa . 455 parts In-Stock

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$1.040

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455

$1.040

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Component Stockers USA

USA . 2,400 parts In-Stock

1+ parts

$4.880

100+ parts

$4.630

1k+ parts

$4.490

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2,400

$4.880

$4.630

$4.490

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AZTECH Wire

Italy . 566 parts In-Stock

1+ parts

$8.201

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566

$8.201

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Ampacity Inc.

Singapore . 1,113 parts In-Stock

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$42.500

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$42.500

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Metaverse IC Inc.

Canada . 38,652 parts In-Stock

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Perfect Parts

USA . 17,511 parts In-Stock

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Kepictronics

USA . 15,000 parts In-Stock

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Lixinc

USA . 14,886 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 11,231 parts In-Stock

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RC Electronics

USA . 7,573 parts In-Stock

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SupplyDigital Components

Austria . 6,509 parts In-Stock

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TANS Electronics

Latvia . 5,775 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Kulean Microsystems

USA . 3,326 parts In-Stock

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3,326

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Infinite Electronics LLP (Excess)

. 2,504 parts In-Stock

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Problanco Electronics

Mexico . 2,221 parts In-Stock

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Corphita

USA . 1,790 parts In-Stock

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UHIMA Technologies

Türkiye . 416 parts In-Stock

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416

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Microchip USA

USA . 259 parts In-Stock

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259

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Technical Specifications

Peripheral Drivers NID6002NT4G attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Peak Reflow Temperature (C):

260

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

NID6002NT4G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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