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NCV891330PD38R2G

Onsemi

NCV891330PD38R2G by Onsemi

NCV891330PD38R2G by Onsemi is a switching regulator with max output current of 4.9A, operating temp range -40 to 150 °C, and PWM control mode. Ideal for automotive applications due to its compact size, high efficiency (2200kHz), and wide input voltage range (4.5-28V).

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

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Digiode

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AZTECH Wire

Italy . 548 parts In-Stock

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$11.000

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QUARKTWIN TECHNOLOGY LTD

USA . 18,721 parts In-Stock

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Perfect Parts

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Problanco Electronics

Mexico . 7,973 parts In-Stock

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Kulean Microsystems

USA . 5,216 parts In-Stock

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Kepictronics

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SupplyDigital Components

Austria . 4,625 parts In-Stock

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TANS Electronics

Latvia . 3,004 parts In-Stock

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Corphita

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Corohmni

South Africa . 408 parts In-Stock

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UHIMA Technologies

Türkiye . 347 parts In-Stock

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Microchip USA

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Overview

Discover the NCV891330PD38R2G by Onsemi, a cutting-edge switching regulator & controller designed for high-performance applications. With a focus on quality and reliability, Onsemi is a trusted manufacturer known for delivering top-notch products to meet your needs. This versatile device offers unparalleled value with its compact design, precise control mode, and wide temperature range suitable for automotive environments. Experience seamless operation and efficient power management with the NCV891330PD38R2G, making it the ideal choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is lightweight and durable, making the product suitable for various applications without adding unnecessary weight.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and space.

Maximum Operating Temperature: 150 °C

Can withstand high operating temperatures, ensuring reliability in harsh environmental conditions.

Minimum Output Voltage: 3.724 V

Provides precise and stable output voltage for consistent performance.

Control Mode: CURRENT-MODE

Current-mode control ensures efficient and stable regulation of output voltage.

Terminal Finish: MATTE TIN

Matte tin finish on terminals enhances solderability and conductivity, improving overall performance.

Maximum Switching Frequency: 2200 kHz

High switching frequency allows for efficient power conversion and minimizes output voltage ripple.

Nominal Output Voltage: 3.8 V

Close to the desired output voltage, providing optimal performance for the intended application.

Technical Specifications

Switching Regulators & Controllers NCV891330PD38R2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

28 V

Minimum Input Voltage:

4.5 V

Nominal Input Voltage:

13.2 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

4.9 A

Maximum Output Voltage:

3.876 V

Minimum Output Voltage:

3.724 V

Nominal Output Voltage:

3.8 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

2200 kHz

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

NCV891330PD38R2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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