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NCV81598MWTXG

Onsemi

NCV81598MWTXG by Onsemi

NCV81598MWTXG by Onsemi is a 32-terminal switching controller with a control mode of current-mode and PWM technique. It operates b/w -40 to 100 °C, with input voltage range of 4.5-32 V and output voltage from 0.5-20 V. Ideal for automotive applications due to its compact square package style and buck-boost switcher configuration.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Digiode

USA . 460 parts In-Stock

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Vyrian

USA . 240 parts In-Stock

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SupplyDigital Components

Austria . 7,748 parts In-Stock

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Problanco Electronics

Mexico . 6,306 parts In-Stock

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TANS Electronics

Latvia . 2,228 parts In-Stock

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Corphita

USA . 2,188 parts In-Stock

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Kulean Microsystems

USA . 624 parts In-Stock

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Corohmni

South Africa . 159 parts In-Stock

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UHIMA Technologies

Türkiye . 150 parts In-Stock

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Overview

Experience superior performance and reliability with the NCV81598MWTXG by Onsemi, a cutting-edge switching regulator that guarantees optimal efficiency and precision in a compact square package. Manufactured by industry leader Onsemi, this chip carrier boasts a very thin profile and a quad terminal position, making it ideal for a wide range of automotive applications. With a control mode of current-mode and a switcher config of buck-boost, this regulator ensures seamless operation in any environment. Trust Onsemi to deliver top-notch quality and innovation with the NCV81598MWTXG, providing unmatched value and benefits to customers looking for the best in switching regulators and controllers.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and secure attachment to PCBs, making it suitable for mass production and compact designs.

Package Shape: SQUARE

Square shape helps in efficient placement on PCB, optimizing space usage and improving thermal performance.

No. of Terminals: 32

Higher number of terminals provide more flexibility for connections and functionalities in electronic circuits.

Maximum Operating Temperature: 100 °C

Can operate in high temperature environments, suitable for automotive and industrial applications.

Minimum Output Voltage: 0.5 V

Provides the ability to step down voltage to very low levels, enabling versatility in power supply designs.

Control Mode: CURRENT-MODE

Offers efficient and precise current control, important for stability and performance in switching regulators.

Maximum Output Voltage: 20 V

Capable of providing higher output voltage levels, suitable for a wide range of applications including power amplification.

Width (mm): 5 mm

Compact width enables space-saving on the PCB, important for designing compact electronic devices.

Nominal Output Voltage: 1 V

Provides a stable and regulated output voltage, critical for powering sensitive electronics.

Technical Specifications

Switching Regulators & Controllers NCV81598MWTXG attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

32 V

Minimum Input Voltage:

4.5 V

Nominal Input Voltage:

12 V

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Voltage:

20 V

Minimum Output Voltage:

.5 V

Nominal Output Voltage:

1 V

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1 mm

Surface Mount:

YES

Switcher Config:

BUCK-BOOST

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

5 mm

Trade Compliance

NCV81598MWTXG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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