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NCV881930MW00R2G

Onsemi

NCV881930MW00R2G by Onsemi

NCV881930MW00R2G by Onsemi is a current-mode switching controller with a max switching frequency of 574 kHz. It operates in buck configuration, with nominal input voltage at 13V and output voltage at 3.3V. This chip carrier package with matte tin finish is ideal for compact applications requiring efficient power regulation.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,576 parts In-Stock

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Digiode

USA . 537 parts In-Stock

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537

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Distributors (Availability)

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AZTECH Wire

Italy . 365 parts In-Stock

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$16.240

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365

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Advanced Electronics

New Zealand . 23 parts In-Stock

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$21.893

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$19.923

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$17.952

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23

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$17.952

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Problanco Electronics

Mexico . 7,624 parts In-Stock

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TANS Electronics

Latvia . 6,836 parts In-Stock

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SupplyDigital Components

Austria . 6,684 parts In-Stock

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Kulean Microsystems

USA . 2,500 parts In-Stock

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Microchip USA

USA . 2,103 parts In-Stock

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Corphita

USA . 1,517 parts In-Stock

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UHIMA Technologies

Türkiye . 465 parts In-Stock

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Corohmni

South Africa . 342 parts In-Stock

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Overview

Discover the NCV881930MW00R2G by Onsemi, a top-tier manufacturer known for delivering high-quality Switching Regulators & Controllers. This innovative product offers exceptional value with its efficient design and versatile applications. With a focus on customer satisfaction, Onsemi has created a product that provides reliable performance and precise control. Whether you're looking to enhance your power management system or streamline your electronics project, the NCV881930MW00R2G is the perfect solution for all your needs. Experience the benefits of this cutting-edge technology and elevate your projects to new heights with Onsemi's superior craftsmanship.

Feature Benefit Bullets

Surface Mount: YES

Easy and efficient installation onto PCB, saving space and reducing assembly time.

Package Shape: SQUARE

Square shape allows for easier positioning and alignment on the PCB.

No. of Terminals: 24

Sufficient terminals for connecting various components and enabling versatile functionality.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Combination of heat sink/slug and thin profile ensures effective heat dissipation and compact design.

Control Mode: CURRENT-MODE

Current-mode control offers fast and precise response to load changes, improving overall efficiency.

Terminal Finish: MATTE TIN

Matte tin finish provides a reliable and corrosion-resistant connection for long-term performance.

Terminal Position: QUAD

Quad terminal arrangement simplifies PCB layout and enhances signal integrity.

Maximum Seated Height: 0.9 mm

Low profile design saves space and allows for compact electronic devices.

Width (mm): 4 mm

Narrow width facilitates dense packing of components on the PCB.

Other IC type: SWITCHING CONTROLLER

Switching controller offers efficient power management and regulation for optimal performance.

Nominal Input Voltage: 13 V

Ideal input voltage range for various applications, providing flexibility and compatibility.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for quick and reliable soldering during assembly.

Peak Reflow Temperature °C: 260

High reflow temperature ensures strong and durable solder joints.

Length: 4 mm

Compact length contributing to overall small form factor and space-saving design.

Maximum Switching Frequency: 574 kHz

High switching frequency enables fast response times and efficient power conversion.

Terminal Form: NO LEAD

Lead-free terminal form for environmentally friendly and RoHS compliant manufacturing.

Control Technique: PULSE WIDTH MODULATION

PWM control technique provides precise output voltage regulation and stability.

Switcher Config: BUCK

Buck configuration for step-down voltage conversion, suitable for many power supply applications.

Terminal Pitch: 0.5 mm

Fine pitch spacing for compact layout and high-density integration on the PCB.

Minimum Input Voltage: 4.5 V

Wide input voltage range accommodates diverse power sources and operational conditions.

Nominal Output Voltage: 3.3 V

Stable output voltage at 3.3 V suitable for powering various electronic components.

Maximum Input Voltage: 37 V

High input voltage capacity for handling more demanding power requirements.

Technical Specifications

Switching Regulators & Controllers NCV881930MW00R2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Additional Features:

IT ALSO HAS 5 V OUTPUT

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

37 V

Minimum Input Voltage:

4.5 V

Nominal Input Voltage:

13 V

JESD-30 Code:

S-XQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Nominal Output Voltage:

3.3 V

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

574 kHz

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

NCV881930MW00R2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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