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NCV8502DADJR2

Onsemi

NCV8502DADJR2 by Onsemi

NCV8502DADJR2 by Onsemi is an adjustable positive single output LDO regulator with a max output current of 0.15 A and a max dropout voltage of 0.6 V, suitable for applications requiring precise voltage regulation in automotive environments. This regulator operates within a wide temperature range from -40 to 150 °C and offers excellent load regulation of 2.4%.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Chip Stock

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Digiode

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Bristol Electronics

USA . 536 parts In-Stock

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Atlantic Semiconductor

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AZTECH Wire

Italy . 1,210 parts In-Stock

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Problanco Electronics

Mexico . 7,253 parts In-Stock

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TANS Electronics

Latvia . 6,822 parts In-Stock

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Kulean Microsystems

USA . 5,766 parts In-Stock

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SupplyDigital Components

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UHIMA Technologies

Türkiye . 687 parts In-Stock

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Microchip USA

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Overview

Experience the unparalleled quality and reliability of Onsemi with the NCV8502DADJR2 Adjustable Regulator. Designed to provide precise and stable power output, this LDO regulator is perfect for a wide range of applications. From automotive to industrial, this product offers exceptional performance and efficiency. Trust in Onsemi's cutting-edge technology and superior manufacturing standards to deliver the best-in-class solution for your power management needs. Enjoy the value and benefits that the NCV8502DADJR2 brings to your projects, setting you apart from the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the internal components, making the product long-lasting.

Maximum Dropout Voltage-1: 1.6 V

Low dropout voltage ensures efficient regulation of output voltage even when the input voltage is very close to the output voltage.

Surface Mount: YES

Surface mount technology makes the product easy to integrate into PCB designs, saving space and enabling mass production.

Operating Temperature (TJ-Max): 150 °C

Can operate at high temperatures without compromising performance, suitable for demanding industrial environments.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and quality assurance, ensuring reliable performance in automotive applications.

Technology: BIPOLAR

Bipolar technology provides accurate and stable voltage regulation, making the product suitable for precision electronic devices.

Minimum Output Voltage-1: 1.242 V

Low minimum output voltage allows for precise voltage regulation, suitable for applications requiring low-voltage operation.

Operating Temperature (TJ-Min): -40 °C

Can operate in extreme cold temperatures, making it suitable for outdoor or refrigeration applications.

Technical Specifications

Adjustable Regulators - Positive Single Output LDO NCV8502DADJR2 attributes and parameters. Explore more Adjustable Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

ADJUSTABLE

Maximum Dropout Voltage-1:

.6 V

Nominal Dropout Voltage-1:

.4 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Maximum Line Regulation (%/V):

.2

Maximum Load Regulation (%):

2.4 %

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

8

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Voltage-1:

1.318 V

Minimum Output Voltage-1:

1.242 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

235

Qualification Status:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

NCV8502DADJR2 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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