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NCV8152MX180180TCG

Onsemi

NCV8152MX180180TCG by Onsemi

NCV8152MX180180TCG by Onsemi is a Fixed Positive Multiple Output LDO Regulator with 1.8V nominal output voltage, 0.42V max dropout voltage, and AEC-Q100 screening level. It is ideal for automotive applications requiring stable power supply with dual outputs in a small outline package.

Median Price

$0.160

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 69,000 parts In-Stock

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$0.160

69,000

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$0.160

Flip Electronics (Authorized)

USA . 69,000 parts In-Stock

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69,000

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Distributors (In-Stock)

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Vyrian

USA . 356 parts In-Stock

1+ parts

$0.160

100+ parts

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356

$0.160

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Flip Electronics

USA . 69,000 parts In-Stock

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69,000

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Digiode

USA . 1,774 parts In-Stock

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1,774

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 385 parts In-Stock

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$0.160

100+ parts

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385

$0.160

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Microchip USA

USA . 2,671 parts In-Stock

1+ parts

$1.040

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2,671

$1.040

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SupplyDigital Components

Austria . 8,281 parts In-Stock

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TANS Electronics

Latvia . 7,544 parts In-Stock

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Kulean Microsystems

USA . 7,164 parts In-Stock

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UHIMA Technologies

Türkiye . 762 parts In-Stock

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Corphita

USA . 584 parts In-Stock

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584

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Problanco Electronics

Mexico . 59 parts In-Stock

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59

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Overview

Discover the NCV8152MX180180TCG by Onsemi, a top-tier manufacturer known for delivering high-quality Fixed Regulators - Positive Multiple Output LDO. This versatile product offers reliable performance and precision voltage regulation for a variety of applications, making it an ideal choice for your next project. With its compact design and advanced features, the NCV8152MX180180TCG provides exceptional value, efficiency, and reliability to meet all your power supply needs. Experience the difference with Onsemi's innovative solutions today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures durability and resistance to external factors, making this product reliable for various applications.

Maximum Dropout Voltage-1: 1.42 V

The low maximum dropout voltage ensures minimal power loss and efficient voltage regulation, making this product energy-efficient.

Surface Mount: YES

The surface mount feature allows for easy and convenient integration onto PCBs, saving space and simplifying the assembly process.

Operating Temperature (TJ-Max): 125 °C

The high operating temperature allows for reliable performance in extreme temperature conditions, increasing the product's versatility.

Minimum Output Voltage-2: 1.72 V

The minimum output voltage ensures compatibility with a wide range of components, making this product suitable for various circuit designs.

Regulator Type: FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR

The fixed positive multiple output LDO regulator type provides stable and accurate voltage regulation for multiple outputs, making this product ideal for applications requiring multiple voltage levels.

Technical Specifications

Fixed Regulators - Positive Multiple Output LDO NCV8152MX180180TCG attributes and parameters. Explore more Fixed Regulators - Positive Multiple Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.42 V

Nominal Dropout Voltage-1:

.27 V

Maximum Dropout Voltage-2:

.42 V

Maximum Input Voltage Absolute:

6 V

Maximum Input Voltage:

5 V

Minimum Input Voltage:

2.5 V

JESD-30 Code:

S-PDSO-N6

Length:

1.2 mm

Maximum Line Regulation:

.0045 %

Maximum Load Regulation:

.05 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

2

No. of Terminals:

6

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Current-2:

.15 A

Maximum Output Voltage-1:

1.88 V

Minimum Output Voltage-1:

1.72 V

Nominal Output Voltage-1:

1.8 V

Maximum Output Voltage-2:

1.88 V

Minimum Output Voltage-2:

1.72 V

Nominal Output Voltage-2:

1.8 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.05,16

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

.45 mm

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Voltage Tolerance:

Width:

1.2 mm

Trade Compliance

NCV8152MX180180TCG Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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