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NCV8152MX180150TCG

Onsemi

NCV8152MX180150TCG by Onsemi

NCV8152MX180150TCG by Onsemi is a Fixed Positive Multiple Output LDO Regulator with 1.8V and 1.5V nominal output voltages, suitable for AEC-Q100 applications. It has a max dropout voltage of 0.42V, operates in temperatures ranging from -40 to 125 °C, and offers a max output current of 0.15A per channel.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,914 parts In-Stock

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Digiode

USA . 1,073 parts In-Stock

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Kulean Microsystems

USA . 8,342 parts In-Stock

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Corphita

USA . 2,160 parts In-Stock

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Problanco Electronics

Mexico . 1,784 parts In-Stock

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TANS Electronics

Latvia . 703 parts In-Stock

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SupplyDigital Components

Austria . 669 parts In-Stock

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Corohmni

South Africa . 426 parts In-Stock

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UHIMA Technologies

Türkiye . 421 parts In-Stock

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Overview

Experience the unparalleled quality and reliability of Onsemi with the NCV8152MX180150TCG Fixed Regulator. This innovative product offers multiple output LDO technology, perfect for a wide range of applications. With AEC-Q100 screening and a compact square package design, this regulator ensures top-notch performance even in challenging conditions. Trust Onsemi to deliver superior products that provide exceptional value and benefits to customers, making your projects more efficient and reliable.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body makes the product lightweight and durable, ensuring long-lasting performance.

Maximum Dropout Voltage-1: 1.42 V

Low dropout voltage ensures efficient regulation of output voltage even when the input voltage is close to the output voltage, leading to stable operation.

Surface Mount: YES

Being surface mountable makes the product easy to install on circuit boards, saving space and providing a clean and compact layout.

Operating Temperature (TJ-Max): 125 °C

With a high maximum operating temperature, the product can withstand elevated temperatures without compromising performance, making it suitable for various environments.

Minimum Output Voltage-2: 1.42 V

Provides a low minimum output voltage, giving flexibility in powering low-voltage components or circuits in a system.

Technical Specifications

Fixed Regulators - Positive Multiple Output LDO NCV8152MX180150TCG attributes and parameters. Explore more Fixed Regulators - Positive Multiple Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.42 V

Nominal Dropout Voltage-1:

.27 V

Maximum Input Voltage Absolute:

6 V

Maximum Input Voltage:

5 V

Minimum Input Voltage:

2.5 V

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e3

Length:

1.2 mm

Maximum Line Regulation:

.0045 %

Maximum Load Regulation:

.05 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

2

No. of Terminals:

6

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Current-2:

.15 A

Maximum Output Voltage-1:

1.88 V

Minimum Output Voltage-1:

1.72 V

Nominal Output Voltage-1:

1.8 V

Maximum Output Voltage-2:

1.58 V

Minimum Output Voltage-2:

1.42 V

Nominal Output Voltage-2:

1.5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.05,16

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

.45 mm

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

Width:

1.2 mm

Trade Compliance

NCV8152MX180150TCG Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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