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NCV33035DWR2

Onsemi

NCV33035DWR2 by Onsemi

NCV33035DWR2 by Onsemi is a motion control IC with a nominal voltage of 20V, suitable for automotive applications. It features a max output current of 0.1A and operates in temperatures ranging from -40 °C to 125°C. This bipolar technology IC comes in a small outline package with dual terminal position and gull wing form.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Chip Stock

USA . 7,400 parts In-Stock

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Vyrian

USA . 4,773 parts In-Stock

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Digiode

USA . 1,118 parts In-Stock

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AZTECH Wire

Italy . 132 parts In-Stock

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SupplyDigital Components

Austria . 8,140 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,602 parts In-Stock

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TANS Electronics

Latvia . 5,621 parts In-Stock

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Kepictronics

USA . 3,700 parts In-Stock

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Kulean Microsystems

USA . 3,641 parts In-Stock

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Corphita

USA . 1,618 parts In-Stock

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Problanco Electronics

Mexico . 1,399 parts In-Stock

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Microchip USA

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Vigor

Singapore . 168 parts In-Stock

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UHIMA Technologies

Türkiye . 132 parts In-Stock

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Corohmni

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Overview

Enhance the performance of your motion control applications with the NCV33035DWR2 by Onsemi. Crafted with precision and expertise, this Brushless DC Motor Controller offers unparalleled quality and reliability. Designed for automotive-grade durability, this IC ensures seamless operation in extreme temperatures. Its compact size and advanced technology make it ideal for a wide range of applications. Experience smoother, more efficient motor control with the NCV33035DWR2 - a game-changer in the world of motion control ICs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability of the package, making it suitable for various applications.

Nominal Supply Voltage (Vsup): 20 V

Nominal voltage of 20V provides a suitable power supply for the motion control IC, ensuring optimal performance.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature range ensures the IC can withstand harsh environmental conditions, making it suitable for automotive applications.

Technology: BIPOLAR

Bipolar technology offers precise control and accurate performance, making it ideal for motion control applications.

Maximum Output Current: 0.1 A

High maximum output current capability allows the IC to drive motors and loads effectively, providing reliable motion control.

Technical Specifications

Motion Control ICs NCV33035DWR2 attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e0

Length:

15.395 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Current (Isup):

20 mA

Maximum Supply Voltage (Vsup):

30 V

Minimum Supply Voltage (Vsup):

10 V

Nominal Supply Voltage (Vsup):

20 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.5 mm

Trade Compliance

NCV33035DWR2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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