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NCV2951ACD-3.3R2

Onsemi

NCV2951ACD-3.3R2 by Onsemi

NCV2951ACD-3.3R2 by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max output current of 0.1A. It features a small outline package style, operates at an extended temperature range up to 150 °C, and is suitable for automotive applications due to AEC-Q100 screening level compliance.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 1,083 parts In-Stock

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Digiode

USA . 489 parts In-Stock

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Vigor

Singapore . 433 parts In-Stock

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$0.230

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SupplyDigital Components

Austria . 7,663 parts In-Stock

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TANS Electronics

Latvia . 7,025 parts In-Stock

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Kulean Microsystems

USA . 3,516 parts In-Stock

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Corphita

USA . 2,232 parts In-Stock

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Problanco Electronics

Mexico . 948 parts In-Stock

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Microchip USA

USA . 145 parts In-Stock

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Corohmni

South Africa . 125 parts In-Stock

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UHIMA Technologies

Türkiye . 8 parts In-Stock

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Overview

Experience superior quality and reliability with the NCV2951ACD-3.3R2 by Onsemi, a leading manufacturer in the industry. This fixed positive single output LDO regulator offers exceptional value and benefits, ensuring stable voltage output for a wide range of applications. With its compact package style and high operating temperature, this regulator is perfect for automotive, industrial, and consumer electronics. Trust in Onsemi's technology and expertise to deliver top-notch performance every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this product lightweight and durable, ideal for applications where weight and size are important factors.

Maximum Dropout Voltage-1: 1.45 V

The low maximum dropout voltage of 1.45 V ensures that the regulator can maintain a stable output voltage even when the input voltage is close to the output voltage, making it reliable for various voltage regulation applications.

Surface Mount: YES

Being surface mountable, this regulator can be easily mounted on PCBs, saving space and enabling efficient assembly in compact electronic devices.

Operating Temperature (TJ-Max): 150 °C

With an operating temperature of up to 150 °C, this regulator can withstand high temperature environments, making it suitable for industrial and automotive applications.

Technology: BIPOLAR

The bipolar technology used in this regulator provides accurate and stable output voltage regulation, ensuring reliable performance in various electronic systems.

Packing Method: TR

The TR packing method ensures that the regulator is delivered in tape and reel packaging, making it convenient for automated assembly processes in manufacturing.

Nominal Output Voltage-1: 3.3 V

With a nominal output voltage of 3.3 V, this regulator is suitable for powering a wide range of electronic components and devices that require a stable voltage supply.

No. of Terminals: 8

Having 8 terminals allows for versatile connectivity options, enabling the regulator to be easily integrated into different circuit designs and configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style of this regulator makes it compact and space-saving, ideal for applications where board real estate is limited.

Maximum Output Current-1: 0.1 A

The maximum output current of 0.1 A allows the regulator to provide sufficient power for low to moderate power consumption devices, making it suitable for a wide range of electronic applications.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCV2951ACD-3.3R2 attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED/ADJUSTABLE

Maximum Dropout Voltage-1:

.45 V

Nominal Dropout Voltage-1:

.35 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

30 V

Minimum Input Voltage:

4.3 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Maximum Line Regulation:

.0033 %

Maximum Load Regulation:

.0033 %

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

8

Operating Temperature (TJ-Max):

150 Cel

Maximum Output Current-1:

.1 A

Maximum Output Voltage-1:

3.346 V

Minimum Output Voltage-1:

3.254 V

Nominal Output Voltage-1:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

235

Qualification Status:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Voltage Tolerance:

Width:

3.9 mm

Trade Compliance

NCV2951ACD-3.3R2 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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