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NCS37000DARG

Onsemi

NCS37000DARG by Onsemi

NCS37000DARG by Onsemi is an Interrupt Controller with 8 external interrupts, operating temperature range of -40 to 85 °C, and a supply voltage range of 6-12V. It is designed for industrial applications requiring precise interrupt control in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,206 parts In-Stock

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Vyrian

USA . 1,819 parts In-Stock

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SupplyDigital Components

Austria . 3,397 parts In-Stock

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Kulean Microsystems

USA . 2,861 parts In-Stock

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Problanco Electronics

Mexico . 2,344 parts In-Stock

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Corphita

USA . 740 parts In-Stock

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TANS Electronics

Latvia . 465 parts In-Stock

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Corohmni

South Africa . 86 parts In-Stock

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UHIMA Technologies

Türkiye . 50 parts In-Stock

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Overview

Elevate your electronic designs with the NCS37000DARG from Onsemi, setting the standard for interrupt controllers. Crafted with precision and expertise by Onsemi, this innovative product offers unparalleled reliability and performance. Ideal for a wide range of applications, this interrupt controller boasts cutting-edge technology and top-notch quality. Experience seamless integration, enhanced functionality, and maximum efficiency with the NCS37000DARG – the ultimate solution for your design needs. Elevate your projects to new heights with Onsemi's NCS37000DARG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable electronic devices.

Surface Mount: YES

The surface mount feature provides easy and efficient installation on circuit boards, saving space and allowing for automated assembly.

Maximum Supply Voltage: 12 V

The high maximum supply voltage allows for versatility in different power supply configurations, making the product compatible with a wide range of systems.

Package Shape: RECTANGULAR

The rectangular package shape is a common and convenient form factor that simplifies integration with other components on the circuit board.

No. of Terminals: 20

Having 20 terminals provides ample connection points for interfacing with various input and output devices, increasing the product's versatility.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style enhances the product's compactness and allows for efficient use of board space in electronic designs.

Minimum Supply Voltage: 6 V

The low minimum supply voltage ensures compatibility with a wide range of power sources, making the product suitable for diverse applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range enables the product to withstand harsh environmental conditions, improving its reliability and durability.

No. of External Interrupts: 8

Having 8 external interrupts allows the product to efficiently manage and prioritize interrupts from external sources, enhancing the overall performance of the system.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range ensures the product can function reliably in cold environments, making it suitable for various industrial and outdoor applications.

Terminal Position: DUAL

The dual terminal position provides redundancy and flexibility in connecting the product to external devices, ensuring reliable signal transmission and compatibility.

Maximum Seated Height: 1.2 mm

The low maximum seated height reduces the overall profile of the product, making it suitable for compact electronic designs where space is limited.

Width: 4.4 mm

The narrow width of the product allows for efficient use of board space, enabling compact and densely packed electronic designs.

Length: 6.5 mm

The compact length of the product further contributes to its space-saving design, making it suitable for applications where size constraints are critical.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating ensures the product can operate reliably in a wide range of temperature conditions typically found in industrial environments.

Peripheral IC Type: INTERRUPT CONTROLLER

Being an interrupt controller IC, the product efficiently manages and prioritizes interrupt requests from external devices, ensuring smooth and efficient operation of the system.

Technology: CMOS

The CMOS technology used in the product provides low power consumption and high noise immunity, contributing to the product's efficiency and reliability.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and secure mounting on the circuit board, ensuring reliable electrical connections and mechanical stability.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for closely spaced terminals, enabling high-density mounting and efficient use of board space in compact electronic designs.

Technical Specifications

Interrupt Controllers NCS37000DARG attributes and parameters. Explore more Interrupt Controllers devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

No. of External Interrupts:

8

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

12 V

Minimum Supply Voltage:

6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

NCS37000DARG Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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