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NCS37000DAG

Onsemi

NCS37000DAG by Onsemi

NCS37000DAG by Onsemi is an Interrupt Controller with 8 external interrupts, operating temperature range of -40 to 85 °C, and supply voltage from 6V to 12V. It is a CMOS technology-based IC suitable for industrial applications requiring interrupt handling in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,207 parts In-Stock

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Vyrian

USA . 1,830 parts In-Stock

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Kulean Microsystems

USA . 8,022 parts In-Stock

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Problanco Electronics

Mexico . 3,738 parts In-Stock

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Corphita

USA . 2,048 parts In-Stock

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TANS Electronics

Latvia . 1,460 parts In-Stock

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SupplyDigital Components

Austria . 812 parts In-Stock

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UHIMA Technologies

Türkiye . 404 parts In-Stock

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404

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Corohmni

South Africa . 360 parts In-Stock

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Overview

Enhance your devices with the cutting-edge NCS37000DAG Interrupt Controller by Onsemi. Designed with top-quality materials and advanced technology, this product offers unrivaled performance and reliability. With a wide range of applications in various industries, this compact and efficient device provides seamless integration, improved functionality, and simplified operations. Trust Onsemi, a reputable manufacturer known for innovation and excellence, to deliver superior products that meet your needs. Upgrade your systems today with the NCS37000DAG and experience enhanced performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving on PCBs.

Maximum Supply Voltage: 12 V

The high maximum supply voltage ensures compatibility with a wide range of power sources.

Package Shape: RECTANGULAR

The rectangular shape provides a compact design that can easily fit into tight spaces on a circuit board.

No. of Terminals: 20

The high number of terminals allows for multiple connections and enhances the functionality of the product.

Minimum Supply Voltage: 6 V

The low minimum supply voltage ensures that the product can operate efficiently even with lower power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows the product to function reliably in various environmental conditions.

No. of External Interrupts: 8

The presence of 8 external interrupts enables the product to handle multiple input signals simultaneously.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the product can withstand cold temperatures without performance issues.

Peripheral IC Type: INTERRUPT CONTROLLER

Being an interrupt controller, this product helps manage and prioritize interrupts effectively, improving overall system performance.

Technical Specifications

Interrupt Controllers NCS37000DAG attributes and parameters. Explore more Interrupt Controllers devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

No. of External Interrupts:

8

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

12 V

Minimum Supply Voltage:

6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

NCS37000DAG Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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