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NCP703SN19T1G

Onsemi

NCP703SN19T1G by Onsemi

NCP703SN19T1G by Onsemi is a BICMOS technology LDO regulator with 0.3A output current, 1.9V nominal output voltage, and 2% voltage tolerance. Ideal for automotive applications due to AEC-Q100 screening level and operating temperature range of -40°C to 125°C. Package style: small outline, thin profile, shrink pitch.

Median Price

$0.355

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,170 parts In-Stock

1+ parts

$0.470

100+ parts

$0.254

1k+ parts

$0.215

10k+ parts

$0.196

1,170

$0.470

$0.254

$0.215

$0.196

Mouser Electronics

USA . 2,997 parts In-Stock

1+ parts

$0.480

100+ parts

$0.262

1k+ parts

$0.222

10k+ parts

$0.197

2,997

$0.480

$0.262

$0.222

$0.197

Rochester

USA . 8,250 parts In-Stock

1+ parts

-

100+ parts

$0.240

1k+ parts

$0.200

10k+ parts

$0.178

8,250

-

$0.240

$0.200

$0.178

Verical

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

$0.223

6,000

-

-

-

$0.223

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,798 parts In-Stock

1+ parts

$0.598

100+ parts

-

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1,798

$0.598

-

-

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Flip Electronics

USA . 18,000 parts In-Stock

1+ parts

-

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18,000

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Vyrian

USA . 64 parts In-Stock

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64

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Prism Electronics

USA . 20 parts In-Stock

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20

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,198 parts In-Stock

1+ parts

$0.567

100+ parts

-

1k+ parts

-

10k+ parts

-

1,198

$0.567

-

-

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Corohmni

South Africa . 387 parts In-Stock

1+ parts

$0.630

100+ parts

-

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387

$0.630

-

-

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Vigor

Singapore . 250 parts In-Stock

1+ parts

$0.910

100+ parts

-

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250

$0.910

-

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AZTECH Wire

Italy . 64 parts In-Stock

1+ parts

$14.360

100+ parts

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64

$14.360

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Perfect Parts

USA . 37,520 parts In-Stock

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37,520

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SupplyDigital Components

Austria . 6,749 parts In-Stock

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6,749

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Lixinc

USA . 2,086 parts In-Stock

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2,086

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Kulean Microsystems

USA . 1,731 parts In-Stock

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1,731

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TANS Electronics

Latvia . 1,546 parts In-Stock

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1,546

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Microchip USA

USA . 1,250 parts In-Stock

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1,250

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Futuretech Components

Singapore . 683 parts In-Stock

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683

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Problanco Electronics

Mexico . 380 parts In-Stock

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380

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UHIMA Technologies

Türkiye . 355 parts In-Stock

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355

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Overview

Unleash the power of precision with the NCP703SN19T1G by Onsemi! Crafted by a trusted manufacturer, this fixed regulator LDO offers unparalleled quality and reliability. Perfect for a wide range of applications, this regulator provides stable output voltage with minimal dropout, ensuring optimal performance in your electronic devices. Say goodbye to power fluctuations and hello to seamless functionality with the NCP703SN19T1G. Elevate your projects with this top-notch component today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, which is ideal for portable and long-lasting applications.

Maximum Dropout Voltage: 1.3 V

With a low maximum dropout voltage, this regulator is efficient and minimizes power loss, making it suitable for energy-sensitive devices.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on PCBs, saving space and simplifying the manufacturing process.

Operating Temperature (TJ-Max): 125 °C

The wide operating temperature range of up to 125°C ensures reliable performance in harsh environments and temperature variations.

Screening Level: AEC-Q100

AEC-Q100 screening level ensures that the product meets automotive industry standards, making it suitable for automotive applications where reliability is critical.

Technology: BICMOS

The BICMOS technology used in this regulator combines the advantages of both bipolar and CMOS technologies, offering high performance and low power consumption.

Package Shape: RECTANGULAR

The rectangular package shape is space-efficient and allows for easy integration into various system designs.

Terminal Form: GULL WING

The gull wing terminal form makes soldering and mounting simple, ensuring a secure connection and reliable performance.

Operating Temperature (TJ-Min): -40 °C

The low minimum operating temperature of -40°C allows the regulator to function effectively in cold environments or during startup conditions.

Packing Method: TR

The TR packing method, typically tape and reel, facilitates automated assembly processes and protects the product during shipping and handling.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP703SN19T1G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.3 V

Nominal Dropout Voltage-1:

.18 V

Maximum Input Voltage Absolute:

6 V

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

2 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.3 A

Maximum Output Voltage-1:

1.938 V

Minimum Output Voltage-1:

1.862 V

Nominal Output Voltage-1:

1.9 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BICMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

2 %

Width:

1.5 mm

Trade Compliance

NCP703SN19T1G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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