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NCP700MN330R2G

Onsemi

NCP700MN330R2G by Onsemi

NCP700MN330R2G by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max dropout voltage of 0.15V, suitable for applications requiring stable voltage regulation in compact spaces. Operating at temperatures up to 150 °C, this BICMOS technology-based regulator has a max output current of 0.2A and can handle input voltages ranging from 2.5V to 5.5V, making it ideal for various electronic devices with space constraints.

Median Price

$0.502

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 364 parts In-Stock

1+ parts

-

100+ parts

$0.502

1k+ parts

$0.417

10k+ parts

$0.371

364

-

$0.502

$0.417

$0.371

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 367 parts In-Stock

1+ parts

$0.391

100+ parts

-

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367

$0.391

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Vyrian

USA . 7,462 parts In-Stock

1+ parts

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7,462

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 625 parts In-Stock

1+ parts

$0.371

100+ parts

-

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-

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625

$0.371

-

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Corohmni

South Africa . 342 parts In-Stock

1+ parts

$0.412

100+ parts

-

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342

$0.412

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-

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Component Stockers USA

USA . 437 parts In-Stock

1+ parts

$0.420

100+ parts

$0.390

1k+ parts

-

10k+ parts

-

437

$0.420

$0.390

-

-

AZTECH Wire

Italy . 752 parts In-Stock

1+ parts

$10.600

100+ parts

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752

$10.600

-

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RC Electronics

USA . 8,100 parts In-Stock

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8,100

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SupplyDigital Components

Austria . 5,450 parts In-Stock

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5,450

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Kulean Microsystems

USA . 5,214 parts In-Stock

1+ parts

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5,214

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UHIMA Technologies

Türkiye . 879 parts In-Stock

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879

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TANS Electronics

Latvia . 786 parts In-Stock

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786

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Problanco Electronics

Mexico . 734 parts In-Stock

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734

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Microchip USA

USA . 266 parts In-Stock

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266

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Overview

Discover the NCP700MN330R2G by Onsemi, a top-notch Fixed Regulator that guarantees unparalleled quality and reliability. Manufactured by Onsemi, a renowned leader in the industry, this LDO regulator offers a stable output voltage of 3.3V with minimal dropout voltage, making it perfect for a wide range of applications. Say goodbye to voltage fluctuations and hello to consistent performance with the NCP700MN330R2G. Trust Onsemi to deliver outstanding products that exceed expectations every time. Elevate your projects with this exceptional regulator today!

Feature Benefit Bullets

Maximum Dropout Voltage-1: 1.15 V

Low dropout voltage ensures stable output voltage even when input voltage is close to the output voltage, making it suitable for applications with tight voltage requirements.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost in production.

Technology: BICMOS

BICMOS technology combines the benefits of both bipolar and CMOS technologies, offering high performance and low power consumption in a single regulator.

Nominal Output Voltage-1: 3.3 V

Stable output voltage of 3.3V makes it ideal for powering digital circuits, microcontrollers, and other electronic devices requiring a fixed voltage supply.

Maximum Output Current-1: 0.2 A

Supports a maximum output current of 200mA, suitable for powering small to medium load applications.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP700MN330R2G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.15 V

Maximum Input Voltage Absolute:

6 V

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

2.5 V

JESD-30 Code:

R-XDSO-N6

JESD-609 Code:

e3

Length:

2.2 mm

Maximum Line Regulation:

.00792 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

6

Operating Temperature (TJ-Max):

150 Cel

Maximum Output Current-1:

.2 A

Maximum Output Voltage-1:

3.366 V

Minimum Output Voltage-1:

3.234 V

Nominal Output Voltage-1:

3.3 V

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC6,.08,25

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BICMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

3 %

Width:

2 mm

Trade Compliance

NCP700MN330R2G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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