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NCP585DSN30T1G

Onsemi

NCP585DSN30T1G by Onsemi

NCP585DSN30T1G by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 3V and max output current of 0.35A. It operates in temperatures ranging from -40 to 125 °C, making it suitable for various applications requiring stable voltage regulation in compact spaces. The package style is small outline, low profile, shrink pitch, ideal for surface mount designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,660 parts In-Stock

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Digiode

USA . 1,323 parts In-Stock

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1,323

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Distributors (Availability)

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Vigor

Singapore . 974 parts In-Stock

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$0.250

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974

$0.250

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AZTECH Wire

Italy . 148 parts In-Stock

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$12.720

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148

$12.720

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Component Stockers USA

USA . 440 parts In-Stock

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$99.990

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SupplyDigital Components

Austria . 7,600 parts In-Stock

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Problanco Electronics

Mexico . 6,724 parts In-Stock

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Perfect Parts

USA . 5,320 parts In-Stock

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TANS Electronics

Latvia . 5,233 parts In-Stock

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Kulean Microsystems

USA . 3,047 parts In-Stock

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Corphita

USA . 2,492 parts In-Stock

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Authorized Procurement Solutions

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UHIMA Technologies

Türkiye . 762 parts In-Stock

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Corohmni

South Africa . 494 parts In-Stock

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Microchip USA

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Overview

Discover the NCP585DSN30T1G by Onsemi, a top-of-the-line Fixed Regulator that ensures reliable and stable power output for your electronic devices. Onsemi's reputable manufacturing standards guarantee exceptional quality and performance, making this LDO regulator perfect for a wide range of applications. With a compact design and high efficiency, this product offers incredible value to customers seeking dependable voltage regulation without compromising on quality. Upgrade your electronics with the NCP585DSN30T1G and experience the benefits of premium power management technology at its best.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for packaging, providing protection to the internal components.

Maximum Dropout Voltage: 1.375 V

Low dropout voltage ensures efficient power regulation and minimal power loss.

Surface Mount: YES

Easy to integrate into surface-mounted PCB designs, saving space and simplifying assembly.

Operating Temperature (TJ-Max): 125 °C

Wide operating temperature range allows for reliable performance in various environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high efficiency.

Package Shape: RECTANGULAR

Rectangular shape is compact and easily fits into modern electronic devices.

Terminal Form: GULL WING

Gull wing terminals provide secure and reliable connections for better conductivity.

Minimum Output Voltage: 2.91 V

Stable output voltage ensures consistent performance of connected components.

Maximum Voltage Tolerance: 3 %

Tight voltage tolerance ensures precise output regulation for sensitive electronics.

Nominal Output Voltage: 3 V

Provides a standard output voltage suitable for a wide range of applications.

No. of Terminals: 5

Sufficient number of terminals for secure and stable connections in the circuit.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Compact and low-profile design ideal for space-constrained applications.

Adjustability: FIXED

Fixed output voltage eliminates the need for adjustment, simplifying circuit design.

Maximum Operating Temperature: 85 °C

High operating temperature ensures reliable performance under normal operating conditions.

Terminal Pitch: 0.95 mm

Close terminal pitch enables easy PCB layout and compact design.

Maximum Line Regulation: 0.015 %

Excellent line regulation ensures stable output voltage despite fluctuations in input voltage.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in harsh environmental conditions.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

Low dropout voltage regulator provides stable and precise output voltage for sensitive electronics.

Terminal Finish: TIN

Tin terminal finish offers good conductivity and corrosion resistance.

Terminal Position: DUAL

Dual terminal position provides redundancy and ensures reliable connections.

Maximum Output Voltage: 3.09 V

Slightly higher maximum output voltage for applications requiring a higher voltage.

Maximum Seated Height: 1.4 mm

Low profile design for applications with height constraints.

Width: 1.65 mm

Narrow width for space-saving installation in compact electronic devices.

Maximum Load Regulation: 0.07 %

Excellent load regulation ensures stable output voltage under varying load conditions.

Minimum Input Voltage: 1.4 V

Low minimum input voltage requirement for efficient power conversion.

Maximum Output Current: 0.35 A

Adequate output current capability for powering typical electronic components.

Maximum Time At Peak Reflow Temperature (s): 30

High tolerance for peak reflow temperature ensures durability during soldering process.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance for robust soldering process.

Nominal Dropout Voltage: 0.24 V

Low dropout voltage ensures efficient power conversion with minimal energy loss.

Length: 2.9 mm

Compact length for space-efficient PCB layout and installation.

Maximum Input Voltage: 6 V

High maximum input voltage tolerance for versatility in power supply requirements.

Maximum Input Voltage Absolute: 6.5 V

Even higher absolute maximum input voltage tolerance for added protection against voltage surges.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP585DSN30T1G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.375 V

Nominal Dropout Voltage-1:

.24 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

6 V

Minimum Input Voltage:

1.4 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.9 mm

Maximum Line Regulation:

.015 %

Maximum Load Regulation:

.07 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

125 Cel

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current-1:

.35 A

Maximum Output Voltage-1:

3.09 V

Minimum Output Voltage-1:

2.91 V

Nominal Output Voltage-1:

3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

3 %

Width:

1.65 mm

Trade Compliance

NCP585DSN30T1G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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