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NCP585DSAN12T1G

Onsemi

NCP585DSAN12T1G by Onsemi

NCP585DSAN12T1G by Onsemi is a Fixed Positive Single Output LDO Regulator with 0.75V max dropout voltage, 1.2V nominal output voltage, and 0.35A max output current. Ideal for applications requiring stable low-voltage power supply in compact electronic devices.

Median Price

$0.390

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

$0.383

1k+ parts

$0.318

10k+ parts

$0.283

9,000

-

$0.383

$0.318

$0.283

Verical

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.398

10k+ parts

$0.354

9,000

-

-

$0.398

$0.354

Distributors (In-Stock)

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Digiode

USA . 382 parts In-Stock

1+ parts

$0.298

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382

$0.298

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Vyrian

USA . 6,296 parts In-Stock

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6,296

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Bristol Electronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$0.309

1k+ parts

$0.231

10k+ parts

$0.214

3,000

-

$0.309

$0.231

$0.214

Microfarads

USA . 2,835 parts In-Stock

1+ parts

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2,835

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Distributors (Availability)

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Corphita

USA . 452 parts In-Stock

1+ parts

$0.283

100+ parts

-

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452

$0.283

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Vigor

Singapore . 268 parts In-Stock

1+ parts

$0.300

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268

$0.300

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Corohmni

South Africa . 362 parts In-Stock

1+ parts

$0.314

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362

$0.314

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AZTECH Wire

Italy . 375 parts In-Stock

1+ parts

$21.700

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375

$21.700

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Kepictronics

USA . 33,000 parts In-Stock

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33,000

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Continental Prestige Electronics

USA . 9,000 parts In-Stock

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$0.266

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9,000

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$0.266

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TANS Electronics

Latvia . 7,801 parts In-Stock

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7,801

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Problanco Electronics

Mexico . 7,128 parts In-Stock

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Kulean Microsystems

USA . 5,257 parts In-Stock

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SupplyDigital Components

Austria . 4,903 parts In-Stock

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Perfect Parts

USA . 1,120 parts In-Stock

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Microchip USA

USA . 344 parts In-Stock

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344

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UHIMA Technologies

Türkiye . 262 parts In-Stock

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262

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Overview

Enhance your electronic devices with the reliable NCP585DSAN12T1G fixed regulator from Onsemi. With a maximum dropout voltage of just 0.75V, this CMOS technology-based LDO regulator ensures stable power output for your applications. The small outline package with flat terminals makes it easy to integrate into your designs. Enjoy the benefits of a precise output voltage of 1.2V with a tight voltage tolerance of 3%. Trust Onsemi's reputation for quality and innovation to deliver superior performance and efficiency. Elevate your projects with the NCP585DSAN12T1G and experience the difference in power regulation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for a wide range of applications.

Maximum Dropout Voltage: 1.75 V

The low maximum dropout voltage ensures efficient regulation of the output voltage, making the product ideal for applications where voltage stability is critical.

Surface Mount: YES

The surface mount capability of the product allows for easy and convenient installation on circuit boards, saving time and effort in the assembly process.

Nominal Output Voltage: 1.2 V

The fixed nominal output voltage of 1.2 V provides a stable and reliable power supply for connected devices, ensuring consistent performance.

Maximum Output Current: 0.35 A

The high maximum output current of 0.35 A allows the regulator to power a wide range of devices, making it versatile and suitable for various applications.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP585DSAN12T1G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.75 V

Nominal Dropout Voltage-1:

.51 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

6 V

Minimum Input Voltage:

1.4 V

JESD-30 Code:

R-PDSO-F6

JESD-609 Code:

e3

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

6

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.35 A

Maximum Output Voltage-1:

1.236 V

Minimum Output Voltage-1:

1.164 V

Nominal Output Voltage-1:

1.2 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

FL6,.11,37

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

3 %

Width:

2.8 mm

Trade Compliance

NCP585DSAN12T1G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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