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NCP584LSN12T1

Onsemi

NCP584LSN12T1 by Onsemi

NCP584LSN12T1 by Onsemi is a Fixed Positive Single Output LDO Regulator with 0.5V max dropout voltage, 1.2V nominal output voltage, and 0.2A max output current. It is ideal for applications requiring stable low-voltage power supplies in compact electronic devices due to its small outline package style and surface-mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,162 parts In-Stock

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5,162

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Digiode

USA . 2,189 parts In-Stock

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2,189

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Distributors (Availability)

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AZTECH Wire

Italy . 316 parts In-Stock

1+ parts

$18.820

100+ parts

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316

$18.820

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Kulean Microsystems

USA . 6,909 parts In-Stock

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6,909

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TANS Electronics

Latvia . 3,668 parts In-Stock

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3,668

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SupplyDigital Components

Austria . 3,373 parts In-Stock

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3,373

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Corphita

USA . 1,750 parts In-Stock

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1,750

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Problanco Electronics

Mexico . 1,590 parts In-Stock

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1,590

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Microchip USA

USA . 454 parts In-Stock

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454

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Corohmni

South Africa . 340 parts In-Stock

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340

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Vigor

Singapore . 200 parts In-Stock

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200

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UHIMA Technologies

Türkiye . 114 parts In-Stock

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Overview

Discover the NCP584LSN12T1 by Onsemi, a top-quality Fixed Regulator that guarantees reliable performance in various applications. Manufactured by Onsemi, a trusted name in the industry, this LDO regulator offers customers the assurance of high-quality standards and seamless operation. With a compact design and low dropout voltage, this product is perfect for powering your electronics efficiently and effectively. Say goodbye to unreliable power sources and hello to the reliability and stability that the NCP584LSN12T1 brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable electronic devices.

Maximum Dropout Voltage-1: 1.5 V

The low maximum dropout voltage ensures efficient power conversion and minimal energy loss, making it suitable for battery-operated applications.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation on PCBs, making the product suitable for automated assembly processes.

Operating Temperature (TJ-Max): 85 °C

The high operating temperature range of up to 85 °C ensures reliable performance in various environmental conditions.

Package Shape: RECTANGULAR

The rectangular package shape provides easy integration into compact electronic devices, optimizing space utilization.

Terminal Form: GULL WING

The gull wing terminal form offers secure and reliable solder connections, ensuring stable electrical connections in the circuit.

Operating Temperature (TJ-Min): -40 °C

The low minimum operating temperature of -40 °C enables the product to function effectively in cold environments or during startup conditions.

Minimum Output Voltage-1: 1.164 V

The minimum output voltage of 1.164V provides a stable and regulated power supply for sensitive components in the circuit.

Maximum Voltage Tolerance: 3 %

The tight voltage tolerance of 3% ensures precise voltage regulation, preventing damage to connected devices and improving system reliability.

Nominal Output Voltage-1: 1.2 V

The nominal output voltage of 1.2V meets the standard voltage requirements of many electronic components, making it compatible with a wide range of applications.

No. of Terminals: 5

The 5 terminals provide multiple connection points for input, output, and ground, offering flexibility in circuit design and configuration options.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline, low profile, and shrink pitch package style minimizes the footprint of the component on the PCB, enabling high-density board layouts and space-saving designs.

Terminal Pitch: 0.95 mm

The small terminal pitch of 0.95mm allows for close component placement on the PCB, reducing signal interference and improving overall system performance.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

The fixed positive single output LDO regulator ensures consistent and stable voltage output, which is essential for sensitive electronic devices requiring precise power supply.

Terminal Finish: TIN LEAD

The tin-lead terminal finish provides excellent solderability and corrosion resistance, ensuring long-term reliability and durability of the product.

Terminal Position: DUAL

The dual terminal position allows for versatile mounting orientations on the PCB, accommodating different layout configurations and assembly requirements.

Maximum Output Voltage-1: 1.236 V

The maximum output voltage of 1.236V ensures stable voltage regulation within the specified limits, preventing voltage spikes and protecting sensitive components.

Maximum Seated Height: 1.4 mm

The low maximum seated height of 1.4mm allows for a compact and space-efficient design, suitable for slim and portable electronic devices.

Width: 1.65 mm

The narrow width of 1.65mm enables the product to be easily integrated into tight spaces and crowded PCB layouts, optimizing board real estate.

Minimum Input Voltage: 1.4 V

The minimum input voltage of 1.4V ensures compatibility with a wide range of power sources, making the product versatile and suitable for various applications.

Maximum Output Current-1: 0.2 A

The maximum output current of 0.2A provides sufficient power delivery capability for low-power electronic devices, ensuring reliable operation under load.

Length: 2.9 mm

The compact length of 2.9mm facilitates easy placement and routing on the PCB, saving valuable board space and simplifying assembly processes.

Maximum Input Voltage: 6 V

The high maximum input voltage of 6V allows for compatibility with various power sources and operating conditions, making the product versatile and adaptable to different environments.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP584LSN12T1 attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Maximum Dropout Voltage-1:

.5 V

Maximum Input Voltage:

6 V

Minimum Input Voltage:

1.4 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e0

Length:

2.9 mm

No. of Functions:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

85 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.2 A

Maximum Output Voltage-1:

1.236 V

Minimum Output Voltage-1:

1.164 V

Nominal Output Voltage-1:

1.2 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Qualification Status:

Not Qualified

Maximum Seated Height:

1.4 mm

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Voltage Tolerance:

3 %

Width:

1.65 mm

Trade Compliance

NCP584LSN12T1 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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