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NCP584HSN30T1G

Onsemi

NCP584HSN30T1G by Onsemi

NCP584HSN30T1G by Onsemi is a fixed positive single output LDO regulator with 3% voltage tolerance, 0.2V dropout voltage, and 0.25A max output current. Ideal for applications requiring stable 3V output voltage in compact designs with surface mount capability.

Median Price

$0.277

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 250 parts In-Stock

1+ parts

-

100+ parts

$0.277

1k+ parts

$0.230

10k+ parts

$0.205

250

-

$0.277

$0.230

$0.205

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,483 parts In-Stock

1+ parts

$0.217

100+ parts

-

1k+ parts

-

10k+ parts

-

1,483

$0.217

-

-

-

Vyrian

USA . 7,976 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

7,976

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,343 parts In-Stock

1+ parts

$0.205

100+ parts

-

1k+ parts

-

10k+ parts

-

1,343

$0.205

-

-

-

Vigor

Singapore . 803 parts In-Stock

1+ parts

$0.220

100+ parts

-

1k+ parts

-

10k+ parts

-

803

$0.220

-

-

-

Corohmni

South Africa . 226 parts In-Stock

1+ parts

$0.224

100+ parts

-

1k+ parts

-

10k+ parts

-

226

$0.224

-

-

-

Component Stockers USA

USA . 210 parts In-Stock

1+ parts

$0.230

100+ parts

$0.220

1k+ parts

-

10k+ parts

-

210

$0.230

$0.220

-

-

AZTECH Wire

Italy . 243 parts In-Stock

1+ parts

$14.070

100+ parts

-

1k+ parts

-

10k+ parts

-

243

$14.070

-

-

-

Kepictronics

USA . 306,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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306,000

-

-

-

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Kulean Microsystems

USA . 7,926 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,926

-

-

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SupplyDigital Components

Austria . 5,779 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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5,779

-

-

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Problanco Electronics

Mexico . 5,167 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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5,167

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-

-

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TANS Electronics

Latvia . 2,442 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,442

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Microchip USA

USA . 314 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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314

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UHIMA Technologies

Türkiye . 162 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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162

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Overview

Unlock the potential of your electronic devices with the NCP584HSN30T1G by Onsemi. Crafted with precision and excellence, Onsemi's Fixed Regulators - Positive Single Output LDO category offers unparalleled reliability and performance. Ideal for a wide range of applications, this product provides a stable output voltage, ensuring optimal functionality for your projects. Trust in Onsemi's expertise to deliver high-quality solutions that exceed expectations. Experience the value and benefits of the NCP584HSN30T1G today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

High quality plastic/epoxy material ensures durability and reliability of the regulator.

Maximum Dropout Voltage: 1.2 V

Low dropout voltage ensures efficient regulation of the output voltage, making it suitable for low voltage applications.

Surface Mount: YES

Surface mount capability makes installation and PCB layout easier and more streamlined.

Operating Temperature (TJ-Max): 125 °C

Wide operating temperature range allows for reliable performance in various environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high efficiency, making the regulator an energy-efficient choice.

Package Shape: RECTANGULAR

Rectangular shape allows for compact and space-saving design, ideal for applications with limited space.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical attachment and solder joint reliability.

Packing Method: TR

TR packing method ensures ease of handling and protection during shipping and storage.

Minimum Output Voltage: 2.91 V

Stable minimum output voltage ensures consistent performance of the regulator.

Maximum Voltage Tolerance: 3%

Low voltage tolerance ensures precise and accurate output voltage regulation.

Nominal Output Voltage: 3 V

Stable nominal output voltage suitable for a wide range of applications.

No. of Terminals: 5

Sufficient number of terminals for easy and secure connections.

Package Style: SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Compact and low-profile package style for space-constrained applications.

Adjustability: FIXED

Fixed output voltage eliminates the need for external adjustment components, simplifying design and reducing costs.

Maximum Operating Temperature: 85 °C

Suitable for operation in moderate temperature environments.

Terminal Pitch: 0.95 mm

Close terminal pitch allows for high-density mounting and space-saving on PCBs.

Maximum Line Regulation: 0.0225%

Low line regulation ensures stable output voltage despite fluctuations in input voltage.

Minimum Operating Temperature: -40 °C

Wide operating temperature range suitable for harsh and extreme environments.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

LDO regulator provides low dropout voltage and stable output voltage regulation for sensitive applications.

Terminal Finish: TIN

Tin terminal finish ensures good solderability and long-term reliability.

Terminal Position: DUAL

Dual terminal position for flexible and secure mounting options on PCBs.

Maximum Output Voltage: 3.09 V

Precise maximum output voltage for consistent performance.

Maximum Seated Height: 1.4 mm

Low seated height for compact and space-saving design.

Width: 1.65 mm

Compact width for space-constrained PCB designs.

Maximum Load Regulation: 0.04%

Low load regulation ensures stable output voltage under varying load conditions.

Minimum Input Voltage: 1.4 V

Wide input voltage range for flexibility in power supply options.

Maximum Output Current: 0.25 A

Sufficient output current for powering various electronic components.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for reliable soldering and reflow processes during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance for robust soldering processes.

Nominal Dropout Voltage: 0.1 V

Low dropout voltage for efficient output voltage regulation.

Length: 2.9 mm

Compact length for space-saving design.

Maximum Input Voltage: 6 V

Wide input voltage range for compatibility with various power sources.

Maximum Input Voltage Absolute: 6.5 V

High absolute input voltage tolerance for reliable operation in demanding conditions.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP584HSN30T1G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.2 V

Nominal Dropout Voltage-1:

.1 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

6 V

Minimum Input Voltage:

1.4 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.9 mm

Maximum Line Regulation:

.0225 %

Maximum Load Regulation:

.04 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

125 Cel

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current-1:

.25 A

Maximum Output Voltage-1:

3.09 V

Minimum Output Voltage-1:

2.91 V

Nominal Output Voltage-1:

3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

3 %

Width:

1.65 mm

Trade Compliance

NCP584HSN30T1G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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