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NCP584HSN12T1

Onsemi

NCP584HSN12T1 by Onsemi

NCP584HSN12T1 by Onsemi is a Fixed Positive Single Output LDO Regulator with 0.5V dropout voltage, 1.2V nominal output, and 0.2A max output current. Ideal for applications requiring stable low-voltage power supply in compact designs due to its small outline package and wide operating temperature range of -40 °C to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,299 parts In-Stock

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Digiode

USA . 510 parts In-Stock

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510

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AZTECH Wire

Italy . 568 parts In-Stock

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$21.490

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568

$21.490

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Component Stockers USA

USA . 722 parts In-Stock

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$99.990

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Problanco Electronics

Mexico . 5,994 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 5,603 parts In-Stock

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Microchip USA

USA . 5,527 parts In-Stock

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Kulean Microsystems

USA . 4,028 parts In-Stock

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TANS Electronics

Latvia . 2,946 parts In-Stock

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SupplyDigital Components

Austria . 626 parts In-Stock

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UHIMA Technologies

Türkiye . 509 parts In-Stock

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Vigor

Singapore . 459 parts In-Stock

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Corohmni

South Africa . 376 parts In-Stock

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Corphita

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Overview

Upgrade your electronic devices with the NCP584HSN12T1 Fixed Regulator by Onsemi. Known for their high-quality products, Onsemi delivers reliable solutions for a wide range of applications. This Single Output LDO regulator ensures stable voltage output, providing optimal performance and protection for your electronic components. With its compact design and excellent efficiency, this product offers customers exceptional value and peace of mind. Trust Onsemi to elevate your projects with top-notch technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Maximum Dropout Voltage: 1.5 V

Allows for stable output voltage even when input voltage fluctuates, making it reliable for various applications.

Surface Mount: YES

Enables easy and convenient installation on circuit boards, saving space and simplifying the manufacturing process.

Operating Temperature (TJ-Max): 85 °C

Can operate effectively in high-temperature environments, making it suitable for industrial applications.

Terminal Form: GULL WING

Facilitates soldering and provides mechanical strength, ensuring secure connections in the circuit.

Nominal Output Voltage: 1.2 V

Provides a stable and consistent output voltage, essential for powering sensitive electronic components.

No. of Terminals: 5

Offers multiple connection points for input and output, enhancing versatility and compatibility with different circuit configurations.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

Designed for precise voltage regulation with low dropout, ensuring a reliable power supply for the connected devices.

Maximum Output Current: 0.2 A

Capable of delivering sufficient current to power small to medium-sized electronic devices, making it ideal for a wide range of applications.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP584HSN12T1 attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Maximum Dropout Voltage-1:

.5 V

Maximum Input Voltage:

6 V

Minimum Input Voltage:

1.4 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e0

Length:

2.9 mm

No. of Functions:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

85 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.2 A

Maximum Output Voltage-1:

1.236 V

Minimum Output Voltage-1:

1.164 V

Nominal Output Voltage-1:

1.2 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Qualification Status:

Not Qualified

Maximum Seated Height:

1.4 mm

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Voltage Tolerance:

3 %

Width:

1.65 mm

Trade Compliance

NCP584HSN12T1 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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